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Micron Products

NAND-Based MCP

Whether you’re trying to minimize power consumption, maximize density, increase speed, or do everything at once, Micron’s NAND MCPs can drive your design no matter the application. Get the reliability your space-constrained design needs with our fully tested, stackable MCPs and PoPs in a variety of packages and technology options—and from a memory provider who manufactures all of the memory elements—including the NAND Flash and mobile LPDRAM.

By Density

NAND Density DRAM Type DRAM Density Pinout Voltage Package
16GB LPDDR3 16Gb, 8Gb n/a 1.8V, 3.3V VFBGA
1Gb LPSDR, LPDDR2, LPDDR 512Mb, 256Mb n/a, JEDEC 1.7V-1.9V, 1.8V TFBGA, VFBGA, WFBGA
2Gb LPDDR2, LPDDR 1Gb n/a, JEDEC 1.8V, 1.7V-1.9V WFBGA, VFBGA, TFBGA, n/a
4Gb LPDDR2, LPDDR 2Gb, 4Gb n/a, JEDEC, TI (OMAP) 1.8V, 1.7V-1.9V WFBGA, VFBGA, TFBGA
4GB LPDDR3, LPDDR2 4Gb, 8Gb n/a 3.3V VFBGA
8Gb LPDDR 4Gb TI (OMAP), n/a, JEDEC 1.7V-1.9V VFBGA, TFBGA
8GB LPDDR3, LPDDR2 8Gb n/a 3.3V VFBGA
View Full NAND-based MCP Part Catalog

By Application

Compact Footprint

Compact Footprint

Squeeze more performance into your space-constrained designs with stacked memory devices.

Reliability

Reliability

Rely on products that are rigorously tested and qualified through close collaboration with OEMs.

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Featured Products

MCP

eMCP

>> See Products

Our eMCPs do more than meet the memory requirements of mid-tier phones and tablets. They save more than 40% space versus discrete memory—reducing the memory footprint, simplifying PCB design, and speeding time to market. Built on a foundation of Micron-manufactured e.MMC (MLC/TLC NAND + microcontroller) and LPDRAM, these JEDEC-compliant, footprint-compatible devices enable simple and flexible system design and certification.

Resources

Title & Description Updated Type
Product Marks/Product and Packaging Labels (pdf) Explains product part marking, and product and packaging labels.
(CSN-11)
05/2015 Customer Service Note Add Email
SLC NAND and Parallel NOR MCP Comparison (pdf) A high-level comparison of our broad portfolio of NAND and NOR MCPs. 03/2015 Product Flyer Add Email
Micron MCP Memory Solutions for IoT and Cellular M2M Applications (pdf) Designers are increasingly turning to multichip package (MCP) solutions to achieve the smallest possible footprint while providing more density and better performance for IoT and M2M module designs. 03/2015 Product Flyer Add Email
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Frequently Asked Questions (1)
Title & Description Updated Type
Multichip Packages FAQs Answers to frequently asked questions about our Multichip Packages. 04/2015 Frequently Asked Questions Add Email