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Micron Products

NAND-Based MCP

Whether you’re trying to minimize power consumption, maximize density, increase speed, or do everything at once, Micron’s NAND MCPs can drive your design no matter the application. Get the reliability your space-constrained design needs with our fully tested, stackable MCPs and PoPs in a variety of packages and technology options—and from a memory provider who manufactures all of the memory elements—including the NAND Flash and mobile LPDRAM.

By Density

NAND Density DRAM Type DRAM Density Pinout Voltage Package
1Gb LPSDR, LPDDR2, LPDDR 512Mb, 256Mb n/a, JEDEC 1.7V-1.9V, 1.8V TFBGA, VFBGA, WFBGA
2Gb LPDDR2, LPDDR 1Gb n/a, JEDEC 1.8V, 1.7V-1.9V WFBGA, VFBGA, TFBGA, n/a
4Gb LPDDR2, LPDDR 2Gb, 4Gb n/a, JEDEC, TI (OMAP) 1.8V, 1.7V-1.9V WFBGA, VFBGA, TFBGA
8Gb LPDDR 4Gb JEDEC, TI (OMAP), n/a 1.7V-1.9V TFBGA, VFBGA
View Full NAND-based MCP Part Catalog

By Application

Compact Footprint

Compact Footprint

Squeeze more performance into your space-constrained designs with stacked memory devices.

Reliability

Reliability

Rely on products that are rigorously tested and qualified through close collaboration with OEMs.

Resources

Title & Description Updated Type
Product Marks/Product and Packaging Labels (pdf) Explains product part marking, and product and packaging labels.
(CSN-11)
05/2015 Customer Service Note Add Email
SLC NAND and Parallel NOR MCP Comparison (pdf) A high-level comparison of our broad portfolio of NAND and NOR MCPs. 03/2015 Product Flyer Add Email
Micron MCP Memory Solutions for IoT and Cellular M2M Applications (pdf) Designers are increasingly turning to multichip package (MCP) solutions to achieve the smallest possible footprint while providing more density and better performance for IoT and M2M module designs. 03/2015 Product Flyer Add Email
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