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Micron Products

NAND-Based MCP

Whether you’re trying to minimize power consumption, maximize density, increase speed, or do everything at once, Micron’s NAND MCPs can drive your design no matter the application. Get the reliability your space-constrained design needs with our fully tested, stackable MCPs and PoPs in a variety of packages and technology options—and from a memory provider who manufactures all of the memory elements—including the NAND Flash and mobile LPDRAM.

By Density

NAND Density DRAM Type DRAM Density Pinout Voltage Package
1Gb LPSDR, LPDDR, LPDDR2 512Mb, 256Mb n/a, JEDEC 1.7V-1.9V, 1.8V TFBGA, VFBGA, WFBGA
2Gb LPDDR, LPDDR2 1Gb JEDEC, n/a 1.7V-1.9V, 1.8V VFBGA, TFBGA, WFBGA, n/a
4Gb LPDDR, LPDDR2 2Gb, 4Gb JEDEC, TI (OMAP), n/a 1.7V-1.9V, 1.8V VFBGA, WFBGA, TFBGA
8Gb LPDDR 4Gb JEDEC, TI (OMAP), n/a 1.7V-1.9V TFBGA, VFBGA
View Full NAND-based MCP Part Catalog

By Application

Compact Footprint

Compact Footprint

Squeeze more performance into your space-constrained designs with stacked memory devices.

Reliability

Reliability

Rely on products that are rigorously tested and qualified through close collaboration with OEMs.

Resources

Title & Description Updated Type
Shipping Quantities (pdf) Provides standard part quantities for shipping.
(CSN-04)
01/2015 Customer Service Note Add Email
Micron BGA Manufacturer's User Guide (pdf) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices.
(CSN-33)
12/2014 Customer Service Note Add Email
FBGA Decoder Micron's FBGA Part Marking Decoder makes it easier to understand part marking. 12/2014 Tool Add Email
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