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Micron Products

NAND-Based MCPs

Whether you’re trying to minimize power consumption, maximize density, increase speed, or do everything at once, Micron’s NAND MCPs can drive your design no matter the application. Get the reliability your space-constrained design needs with our fully tested, stackable MCPs and PoPs in a variety of packages and technology options—and from a memory provider who manufactures all of the memory elements—including the NAND Flash and mobile LPDRAM.

By Density

View Full NAND-based MCP Part Catalog
NAND Density DRAM Type DRAM Density Pinout Voltage Package
1Gb LPSDR, LPDDR, LPDDR2 512Mb, 256Mb n/a, JEDEC 1.7V-1.9V, 1.8V TFBGA, VFBGA, WFBGA
2Gb LPDDR, LPDDR2 1Gb JEDEC, n/a 1.7V-1.9V, 1.8V VFBGA, TFBGA, WFBGA
4Gb LPDDR, LPDDR2 2Gb, 4Gb JEDEC, TI (OMAP), n/a 1.7V-1.9V, 1.8V VFBGA, TFBGA, WFBGA
8Gb LPDDR 4Gb JEDEC, TI (OMAP), n/a 1.7V-1.9V TFBGA, VFBGA

By Application

Compact Footprint

Compact Footprint

Squeeze more performance into your space-constrained designs with stacked memory devices.

Reliability

Reliability

Rely on products that are rigorously tested and qualified through close collaboration with OEMs.

Resources

Featured Case Study

Micron Small Form Factor PoP Helps Gumstix

Updated: 12/2009

Title & Description Updated Type
Micron BGA Manufacturer's User Guide (pdf) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices.
(CSN-33)
12/2014 Customer Service Note Add Email
Micron Component and Module Packaging (pdf) Explanation of Micron packaging labels and procedures.
(CSN-16)
11/2014 Customer Service Note Add Email
Micron MCP Memory Solutions for IoT and Cellular M2M Applications (pdf) Designers are increasingly turning to multichip package (MCP) solutions to achieve the smallest possible footprint while providing more density and better performance for M2M module designs. 10/2014 Product Flyer Add Email
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