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Micron Products

Multichip Packages

Get the critical features and functions for your design—including high performance, high quality, power efficiency, wide density ranges, small package sizes, and industrial temperature ranges—from our broad portfolio of industry-standard multichip packages (MCPs).

By Technology

Technology Benefits Densities Configurations Supply Voltages
NAND-Based MCP

  • Offers high densities for data-intensive applications

  • Provides high speeds, with x8, x16 and x32 bus widths

  • Enables high reliability with SLC NAND that provides up to 100,000 PROGRAM/ERASE cycles


  • NAND Flash

  • Mobile LPDDR2

  • Mobile LPDDR

  • Mobile LPSDR

PoP, VFBGA, TFBGA

NAND:  1Gb–8Gb


LPDRAM: 256Mb–4Gb

NOR-Based MCP

  • Simplifies design while speeding performance for low-density applications

  • Reduces active ball count by more than 50% thanks to shared-bus and A/D MUX options

  • Speeds boot-up and extends battery life with execute-in-place (XIP) functionality

  • Supports low-voltage applications (1.8V)


  • Parallel NOR Flash

  • PSRAM

  • Mobile LPDDR

VFBGA, TFBGA

NOR:  32Mb–512MB


PSRAM: 16Mb–128Mb


LPDDR: 512Mb

Resources

Featured Case Study

Micron Small Form Factor PoP Helps Gumstix

Updated: 12/2009

Featured Product Flyer

Nonvolatile Memory for Multiple Markets

Updated: 01/2014