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Micron Products

Multichip Packages

Get the critical features and functions for your design—including high performance, high quality, power efficiency, wide density ranges, small package sizes, and industrial temperature ranges—from our broad portfolio of industry-standard multichip packages (MCPs).

By Technology

Technology Benefits Densities Configurations Supply Voltages
NAND-Based MCP
Offers high densities for data-intensive applications
Provides high speeds, with x8, x16 and x32 bus widths
Enables high reliability with SLC NAND that provides up to 100,000 PROGRAM/ERASE cycles

NAND Flash
Mobile LPDDR2
Mobile LPDDR
Mobile LPSDR
PoP, VFBGA, TFBGA NAND:  1Gb–8Gb
LPDRAM: 256Mb–4Gb
NOR-Based MCP
Simplifies design while speeding performance for low-density applications
Reduces active ball count by more than 50% thanks to shared-bus and A/D MUX options
Speeds boot-up and extends battery life with execute-in-place (XIP) functionality
Supports low-voltage applications (1.8V)

Parallel NOR Flash
PSRAM
Mobile LPDDR
VFBGA, TFBGA NOR:  32Mb–512MB
PSRAM: 16Mb–128Mb
LPDDR: 512Mb

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