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Micron Products

Multichip Packages

Get the critical features and functions for your design—including high performance, high quality, power efficiency, wide density ranges, small package sizes, and industrial temperature ranges—from our broad portfolio of industry-standard multichip packages (MCPs).

By Technology

Technology Benefits Technology Package Density
NAND-Based MCP
  • Offers high densities for data-intensive applications

  • Provides high speeds, with x8, x16 and x32 bus widths

  • Enables high reliability with SLC NAND that provides up to 100,000 PROGRAM/ERASE cycles

NAND Flash

Mobile LPDDR2

Mobile LPDDR

Mobile LPSDR
PoP, VFBGA, TFBGA NAND:  1Gb–8Gb

LPDRAM: 256Mb–4Gb
NOR-Based MCP
  • Simplifies design while speeding performance for low-density applications

  • Reduces active ball count by more than 50% thanks to shared-bus and A/D MUX options

  • Speeds boot-up and extends battery life with execute-in-place (XIP) functionality

  • Supports low-voltage applications (1.8V)

Parallel NOR Flash

PSRAM

Mobile LPDDR
VFBGA, TFBGA NOR:  32Mb–512MB

PSRAM: 16Mb–128Mb

LPDDR: 512Mb

Resources