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All blog posts tagged "DDR3"

Partnering With Freescale to Enable Internet of Things

Wendy Lee-Kadlec   |   April 28, 2014   |   All Products

Over the past few years, “Internet of Things” (IoT) has become an industry buzz word. Not surprisingly, IoT was also the main theme of the Freescale Technology Forum (FTF) held earlier this month in Dallas, Texas. FTF brings together embedded designers, as well as innovation enablers, like Freescale and Micron, to discuss current industry topics. This is my fifth year attending FTF—and it turned out to be one of the most exciting events yet! ...

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Addressing the tFAW Effect for DDR3

Troy Quick   |   December 17, 2013   |   All Products

Today we announced a solution for an intrinsic DDR3 timing constraint that has been impacting our customers’ system performance. This is great news for networking apps, where tRRD and tFAW timing specifications can restrict much-needed data throughput. Here’s a little background on the issue. Activation delay or tRRD is the amount of time that must elapse between two ACTIVATE commands being issued to different banks.  Four-bank activation window or tFAW is the amount of time i...

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Tags: DRAM, DDR3, Networking

A Look Back at SC13

Richard Murphy   |   December 13, 2013   |   All Products

I attended this year’s Supercomputing Conference (SC13) a few weeks ago and have finally had a chance to sift through all the news announcements, technical sessions, and meeting notes to provide you with a few highlights. Our very own Todd Farrell gave an overview of HMC technology to conference-goers while Micron and Fujitsu announced the integration of our HMC technology into a supercomputer! I think this is a game-changing system design, which will provide flatter, more powerful memory ...

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Optimizing High-speed, Embedded Memory Interface Designs

Steve Durnal   |   March 8, 2013   |   All Products

On March 4, ECN published an article that I wrote where I address considerations in high-speed bus designs for a healthy “data eye.” Read the full article below: Optimizing High-speed, Embedded Memory Interface Designs Designers of energy-efficient, high-speed memory subsystems for small form factor or power-sensitive embedded and wireless products are often making the shift from traditional DDR2/DDR3 to low power (LP) DDR2/DDR3 memory solutions. This is largely in response to the ev...

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Looking to Save Space in Your Ultrathin Design?

Kris Kido   |   February 7, 2013   |   All Products

Single-Sided SODIMM

Today’s ultrathins are all about being the sleekest, lightest, and highest-performance devices available—and we have the DRAM solutions to help you get there. Let’s look at how Micron’s new DRAM form factors reduce system height and saves valuable board space. In an effort to further reduce z-height, a majority of ultrathin laptops have opted out of module form factors in favor of onboard DRAM. And while onboard DRAM is the best solution for z-height, modules bring an ele...

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DDR3L-RS: Reducing DRAM Power Consumption in Standby

Kris Kido   |   January 8, 2013   |   All Products

Standby power savings are becoming increasingly important as computing devices continue to shrink leaving less room for large batteries, and come loaded with advanced features such as instant-on and Microsoft’s Connected Standby. DDR3L-RS (formerly referred to as DDR3Lm) is the first mainstream PC DRAM with a focus on reducing IDD6, doing so by cutting in half the self refresh rate at room temperature (standby conditions) and by selecting lower IDD6 devices. First, TCSR (Temperature C...

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A Full House – 1 GHz Rounds Out DDR3 Portfolio

Steven King   |   June 11, 2012   |   Memory

Our latest DRAM product rounds out our DDR3 offering in a big way for high-end networking and graphics customers. These new 1066MHz, 2133 MT/s data rate DDR3 devices can boost your bandwidth by as much as 33%, without significantly increasing power consumption. We’ve also collaborated with AMD Graphics and LSI to make sure that these parts are optimized for the latest SoCs and GPUs, making your design-in easier and extending the life of your existing DDR3 designs. Check out our 1 GHz DDR3 page ...

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X Marks the Spot for Avnet’s Technical Training Road Show

  |   April 26, 2012   |   Memory

We’re ready to hit the road for X-fest 2012, Avnet and Xilinx’s 22-city tour that takes free technical training to FPGA, DSP, and embedded system designers around the globe. Our experts will be on-hand to show you how easy it is to integrate our memory into your applications—in fact, you’ll see mix of our DDR3, RLDRAM, and NOR Flash on the KC705, Spartan-6, and K7-MMP FPGA boards that Xilinx will be using for their training demos. We hope to see you at an X-fest event&md...

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Ready for Windows 7? Don’t Forget the Memory.

  |   October 22, 2009   |   Memory

I had a chance to sit down with Micron’s Matthias Buchner, director of segment marketing for Micron’s DRAM product group, to talk about the launch of Windows 7, the memory impact and other trends in the industry. Chris Smith: Thanks Matthias for talking with me. I was hoping you could give us some perspective on how the launch of Windows 7 today will impact DRAM demand? Matthias Buchner:  Sure, happy to talk with you. It’s important that we first look at it from the OS...

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Tags: DRAM, DDR3

Driving the Next Generation of Server Performance with LRDIMMs

Corporate Communication   |   July 30, 2009   |   Memory


Today we announced the world’s first DDR3 LRDIMMs, built with our advanced 50nm, DDR3 SDRAM components. If you’re in the server industry, you know that load-reduced DIMMs are going to deliver some much-needed performance and bandwidth boosts for next-generation servers. Their much higher capacity and performance specs mean that early LRDIMM servers will have up to 57% better bandwidth and as much as three times the memory density—up to 144GB. And you can expect those specs to r...

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