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Micron Products

DDR2 SDRAM

A wide array of capabilities makes our DDR2 an excellent memory choice for the diverse needs of many applications—from automotive and industrial to server, consumer, networking, and computing. In fact, we’ve designed both the long-term roadmap and the product features of our DDR2 memory with those needs in mind.

By Density

View Full DDR2 Part Catalog
Density Width Voltage Clock Rate Package Op. Temp.
4Gb x8, x4 1.8V 400 MHz FBGA 0C to +85C
2Gb x16, x4, x8 1.8V 400 MHz, 333 MHz, 533 MHz FBGA 0C to +85C, -40C to +105C, -40C to +95C
1Gb x16, x4, x8 1.8V 400 MHz, 533 MHz, 333 MHz FBGA 0C to +85C, -40C to +105C, -40C to +95C
512Mb x16, x8, x4 1.8V 400 MHz, 533 MHz, 333 MHz FBGA -40C to +105C, -40C to +95C, 0C to +85C

By Application

Performance

Performance

Enable better electrical performance and speed compared to DDR.

Reliability

High Reliability

Withstand extreme temperatures with extended operating ranges.

Density Range

High Density

Enable large memory subsystems with 256Mb to 4Gb densities, thanks to our dual-die package.

Power Efficiency

Low Power

Reduce power with our low 1.55V option.

Resources

Title & Description Updated Type
Micron BGA Manufacturer's User Guide (pdf) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices.
(CSN-33)
12/2014 Customer Service Note Add Email
DRAM Component Part Numbering System (pdf) Part numbering guide for DDR4/DDR3/DDR2/DDR/SDR SDRAM, Mobile LPDRAM, and RLDRAM components 12/2014 Part Numbering Guide Add Email
HMC Part Numbering System (pdf) Part numbering guide for Hybrid Memory Cube 10/2014 Part Numbering Guide Add Email
See All Results