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Micron Products

DDR SDRAM

When we introduced our DDR SDRAM, it was revolutionary and pioneering technology. DDR allows applications to transfer data on both the rising and falling edges of a clock signal, doubling bandwidth and vastly improving performance over SDR SDRAM. To achieve this functionality, we use a 2n-prefetch architecture where the internal data bus is double the size of the external data bus, so data capture can happen two times each clock cycle.

By Density

View Full DDR Part Catalog
Density Width Voltage Clock Rate Package Op. Temp.
1Gb x16, x8, x4 2.5V 167 MHz, 133 MHz TSOP -40C to +85C, 0C to +70C
512Mb x8, x16, x4 2.5V, 2.6V 167 MHz, 200 MHz FBGA, TSOP -40C to +85C, 0C to +70C, -40C to +105C
256Mb x4, x8, x16 2.6V, 2.5V 200 MHz, 167 MHz TSOP, FBGA 0C to +70C, -40C to +85C, -40C to +105C

By Application

Stability and Longevity

Performance

Get long-term product availability and technical support from a dependable DRAM manufacturer.

Broad Portfolio

Low Power

Choose the perfect solution for your design from our broad offering of densities and configurations.

Resources

Title & Description Updated Type
Micron BGA Manufacturer's User Guide (pdf) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices.
(CSN-33)
12/2014 Customer Service Note Add Email
DRAM Component Part Numbering System (pdf) Part numbering guide for DDR4/DDR3/DDR2/DDR/SDR SDRAM, Mobile LPDRAM, and RLDRAM components 12/2014 Part Numbering Guide Add Email
Micron Component and Module Packaging (pdf) Explanation of Micron packaging labels and procedures.
(CSN-16)
11/2014 Customer Service Note Add Email
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