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Micron Products


Most often used in mass storage consumer applications with very high cost sensitivity, our triple-level cell (TLC) NAND has the highest cell density, but the lower performance and endurance specifications. The 64Gb part delivers the same capacity as our 64Gb MLC, but in a die that is 20% smaller, yielding the most cost-effective NAND solution.

Storing 3 bits per cell, TLC NAND devices are value-minded parts used primarily in consumer products that don't require top-tier NAND performance and endurance (fewer PROGRAM/ERASE cycles)—designs like Flash cards, USB thumb drives, and other portable media devices.

Like all raw NAND, TLC NAND requires an external controller to aid with array management, ECC, wear leveling, and other management functions.

By Density

View Full TLC NAND Part Catalog
Density Width Voltage Clock Rate Package Op Temp
128Gb x8 3.3V n/a TSOP 0C to +70C
64Gb x8 3.3V n/a Wafer, TSOP 0C to +70C


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NOR | NAND Flash Guide: Selecting a Flash Storage Solution

Updated: 10/2013

Title & Description Updated Type
Micron BGA Manufacturer's User Guide (pdf) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices.
12/2014 Customer Service Note Add Email
Micron Component and Module Packaging (pdf) Explanation of Micron packaging labels and procedures.
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Product Marks/Product and Packaging Labels (pdf) Explains product part marking, and product and packaging labels.
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