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Micron Products


Most often used in mass storage consumer applications with high cost sensitivity, our triple-level cell (TLC) NAND has the highest cell density, but generally lower performance and endurance specifications. The 128Gb part delivers the same capacity as our 128Gb MLC, but in a die that is 28% smaller.

Storing three bits per cell, TLC NAND devices are value-minded parts used primarily in consumer products that don't require top-tier NAND performance and endurance (fewer PROGRAM/ERASE cycles)—designs like USB thumb drives, client SSDs, and other portable media devices.

Like all raw NAND, TLC NAND requires an external controller to aid with array management, ECC, wear leveling, and other management functions.

By Density

Density Width Voltage Clock Rate Package Op Temp
512Gb x8 3.3V n/a TBGA 0C to +70C
256Gb x8 3.3V n/a TSOP, VBGA 0C to +70C
128Gb x8 3.3V n/a n/a, TSOP, VBGA 0C to +70C
64Gb x8 3.3V n/a TSOP, Wafer 0C to +70C
View Full TLC NAND Part Catalog


Title & Description Updated Type
Industrial and Multimarket Application Memory Flyer (pdf) Our extensive and stable portfolio of IMM-focused memory solutions empower technology developments in automotive, industrial, medical, manufacturing, and other multimarket segments. 07/2015 Product Flyer Add Email
Product Marks/Product and Packaging Labels (pdf) Explains product part marking, and product and packaging labels.
07/2015 Customer Service Note Add Email
Shipping Quantities (pdf) Provides standard part quantities for shipping.
01/2015 Customer Service Note Add Email
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