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Micron Products

Serial NAND

“Embedded applications” has become an umbrella term for some of the most compelling devices available, including intelligent or interactive toys, books, and games; Web-enabled printers and computer peripherals; and backward-compatible WiMAX boxes. In the past, these embedded designs relied only on serial peripheral interface (SPI) NOR Flash for code shadowing, data storage, or storing BIOS and firmware. But as embedded applications continue to evolve and require more density, Serial NAND devices, with the lowest cost-per-megabit of any serial flash solution, offer the right option for them.

With four times or more the density of SPI NOR, Serial NAND is a great alternative to NOR for many embedded designs. And since Serial NAND has the lowest cost-per-megabit of any serial Flash solution, it’s also a great way to lower your BOM cost.

By Density

Density Width Voltage Package Op Temp
4Gb x1 3.3V VFBGA 0C to +70C, -40C to +85C
2Gb x1 3.3V VFBGA -40C to +85C, 0C to +70C
1Gb x1 3.3V VFBGA -40C to +85C, 0C to +70C
View Full Serial NAND Part Catalog

By Application

Density Range

High Density

Design with larger BIOS and more embedded features.

Ecosystem Compatibility

SPI Compatible

Save valuable development time with easy integration.



Get faster write performance compared to other serial memory solutions.


Featured Product Flyer

Industrial and Multimarket Application Memory Flyer

Updated: 09/2014

Title & Description Updated Type
Product Marks/Product and Packaging Labels (pdf) Explains product part marking, and product and packaging labels.
05/2015 Customer Service Note Add Email
Shipping Quantities (pdf) Provides standard part quantities for shipping.
01/2015 Customer Service Note Add Email
Micron BGA Manufacturer's User Guide (pdf) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices.
12/2014 Customer Service Note Add Email
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