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Micron Products


Why complicate your design? If a simple, cost-effective SDRAM solution will do, plug it in and go. You already know it's a reliable part. You know it's got all the features you're looking for. Plus it's a solid long-term solution. We have plans to support it for years to come so it's still a good fit for products with long life cycles.

By Density

View Full SDRAM Part Catalog
Density Width Voltage Clock Rate Package Op. Temp.
512Mb x4, x16, x8 3.3V 133 MHz TSOP 0C to +70C, -40C to +85C
256Mb x16, x8, x4 3.3V 167 MHz, 133 MHz, 166 MHz, 143 MHz TSOP, VFBGA, FBGA 0C to +70C, -40C to +85C, -40C to +105C, n/a
128Mb x32, x16, x8, x4 3.3V 166 MHz, 133 MHz, 143 MHz, 167 MHz TSOP, FBGA, VFBGA -40C to +85C, 0C to +70C, -40C to +105C
64Mb x8, x32, x16 3.3V 133 MHz, 166 MHz, 143 MHz, 167 MHz, 183 MHz, 200 MHz TSOP, VFBGA 0C to +70C, -40C to +85C, -40C to +105C

By Application

Extended Temp

Extended Temperature

Provide optimum performance in extreme environments.

Stability and Longevity


Get long-term support for long-lifecycle designs.


Title & Description Updated Type
Micron BGA Manufacturer's User Guide (pdf) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices.
12/2014 Customer Service Note Add Email
DRAM Component Part Numbering System (pdf) Part numbering guide for DDR4/DDR3/DDR2/DDR/SDR SDRAM, Mobile LPDRAM, and RLDRAM components 12/2014 Part Numbering Guide Add Email
Micron Component and Module Packaging (pdf) Explanation of Micron packaging labels and procedures.
11/2014 Customer Service Note Add Email
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