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Micron Products

SDRAM

Why complicate your design? If a simple, cost-effective SDRAM solution will do, plug it in and go. You already know it's a reliable part. You know it's got all the features you're looking for. Plus it's a solid long-term solution. We have plans to support it for years to come so it's still a good fit for products with long life cycles.

By Density

Density Width Voltage Clock Rate Package Op. Temp.
512Mb x4, x16, x8 3.3V 133 MHz TSOP 0C to +70C, -40C to +85C
256Mb x16, x8, x4 3.3V 167 MHz, 133 MHz, 166 MHz, 143 MHz TSOP, VFBGA, FBGA 0C to +70C, -40C to +85C, -40C to +105C, n/a
128Mb x32, x16, x8, x4 3.3V 166 MHz, 133 MHz, 167 MHz, 143 MHz TSOP, FBGA, VFBGA -40C to +85C, 0C to +70C, -40C to +105C
64Mb x8, x32, x16 3.3V 133 MHz, 166 MHz, 143 MHz, 167 MHz, 183 MHz, 200 MHz TSOP, VFBGA 0C to +70C, -40C to +85C, -40C to +105C
View Full SDRAM Part Catalog

By Application

Extended Temp

Extended Temperature

Provide optimum performance in extreme environments.

Stability and Longevity

Longevity

Get long-term support for long-lifecycle designs.

Resources

Title & Description Updated Type
Shipping Quantities (pdf) Provides standard part quantities for shipping.
(CSN-04)
01/2015 Customer Service Note Add Email
DRAM Component Part Numbering System (pdf) Part numbering guide for DDR4/DDR3/DDR2/DDR/SDR SDRAM, Mobile LPDRAM, and RLDRAM components 12/2014 Part Numbering Guide Add Email
Micron BGA Manufacturer's User Guide (pdf) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices.
(CSN-33)
12/2014 Customer Service Note Add Email
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