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Your Innovation, Our Memory

Your Innovation, Our Memory

Emerging technologies require innovation on a whole new scale. See how we partner closely with our customers to gain unique insights about how we can optimize our memory solutions to enable your innovations—and help you change the world.

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Memory for Automotive

Memory for Automotive

Technology is reshaping the concept of driving. Automakers are developing countless new driver-assistance features and systems. See how Micron’s memory solutions are helping to enable these new supercomputing capabilities.

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About Micron

Where there's memory, there's Micron

Engineered for Innovation

For more than 30 years Micron has redefined innovation by designing, developing, and manufacturing some of the world’s most advanced technologies.

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Elpida is Now Micron

Elpida Is Now Micron

With the combined strength of our products, technology, and team members—our customers now have access to the broadest portfolio of best-in-class technology.

About the acquisition

Welcome to My Workspace!

Create an account to access these benefits:

  • Save part pages
  • Save Data Sheets and other files
  • Create folders to organize your projects
  • Share folders with colleagues
  • Organize secure documents for easy access
  • "Follow" parts to see alerts and updates

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My Folders

Your workspace is your area to organize and save part pages, data sheets, and links for easy access in the future. You can even start by saving some of the pages you've recently accessed below:

VLP UDIMM Standard Page Save
My Workspace

Power Savings for Network Applications

At the heart of our VLP UDIMMs is the world’s most advanced DRAM technology—designed so that your router, hub, switch, or bridge can be faster, smaller, and much more reliable. In fact, our lower-height, ATCA-compliant VLP UDIMMs are specifically made to be stacked vertically--significantly improving airflow and reducing power consumption. Plus, they are compatible with existing sockets.

 

  • Available in a wide range of densities
  • VLP UDIMMs fit vertically on the board, which facilitates better airflow and increases reliability in heat-sensitive systems.
  • Multiple voltages enable flexibility for designs
  • High-density solutions for extended memory capacity.
  • Available in RoHS 6/6 and 5/6 options
  • Stringently tested for quality and reliability
  • Extended temperature range for optimum performance in rugged environments.
  • Online Design Support: offer a host of time-saving support tools free online, including: easy-to-use data sheets, technical notes, simulation models, and online development tools (like SPD data tables)

Featured Article

Serial Presence Detect Tool

Online Tools

To get the most current serial presence-detect (SPD) data, simply visit our online tool to view and download your SPD information.

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Micron Validated Memory

Micron Validated Memory

Micron regularly performs DRAM module validation testing with our key processor partners. This testing verifies that our DDR3 SDRAM complies with various desktop, server, workstation, and notebook motherboard chipsets in order to provide guidance on memory compatibility.

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For VLP UDIMM (1)
Title & Description Secure ID# Updated Type
DRAM for Every Design: Micron DRAM Module Form Factors Quick Reference Guide: (PDF 51.53 KB)Accelerate your time-to-market with quality DRAM modules rigorously tested for reliability in a wide range of applications. From the cost-sensitive needs of consumer computing to the extreme temperature and performance needs of industrial applications to the exacting specifications of enterprise systems, we have the right solution for your design. 01/2014 Product Flyer
For DRAM Modules (28)
Title & Description Secure ID# Updated Type
Module Part Numbering Systems: (PDF 45.25 KB)Part numbering guides for Micron DDR4, DDR3, DDR, DDR, and SDRAM modules. 12/2013 Part Numbering Guide
Routing Guidelines for Micron’s HMC-15G-SR: (PDF 3.3 MB)Provides sound methods, proven solutions, and detailed PCB layout guidelines to enable successful designs using Micron’s HMC. TN-43-03 HMC TN-43-03 06/2013 Technical Note
Proper Handling Procedures for Modules and SSDs: (PDF 997.97 KB)Includes procedures for how to properly handle modules and SSDs. CSN-23 05/2013 Customer Service Note
DDR3 Networking Module Summary: (PDF 185.18 KB) 01/2013 Other Documents
Recommended Soldering Parameters: (PDF 173.37 KB)Defines the recommended soldering techniques and parameters for Micron Technology, Inc., products. TN-00-15 12/2012 Technical Note
Bypass Capacitor Selection for High-Speed Designs: (PDF 481.9 KB)Describes bypass capacitor selection for high-speed designs. TN-00-06 03/2011 Technical Note
Micron Wire-Bonding Techniques: (PDF 66.13 KB)This technical note provides guidance on wire bonding techniques for both nickel-palladium (NiPd) and aluminum (Al) bond pads on Micron products. TN-00-22 11/2010 Technical Note
Uprating of Semiconductors for High-Temperature Applications: (PDF 428.33 KB)Describes the issues associated with temperature uprating and the risks involved in using components and/or systems outside the manufacturer's environmental specifications TN-00-18 05/2010 Technical Note
Accelerate Design Cycles with Simulation Models: (PDF 206.91 KB)Micron supplies the tools and guidelines necessary to verify new designs prior to layout. This technical note discusses software model support, signal integrity optimization, and logic circuit design. TN-00-09 02/2010 Technical Note
Design Guide for Two DDR3-1066 UDIMM Systems: (PDF 1.1 MB)Rev. B, Design guide to assist board designers implementing products using UDIMM systems TN-41-08 01/2010 Technical Note
The Future of Memory and Storage: (PDF 1.54 MB)Overview of trends for main memory and Flash memory 12/2009 Presentation
DDR System Design Considerations: (PDF 3.46 MB)DDR overview 12/2009 Presentation
Competitive DDR Memory Subsystems: (PDF 2.64 MB)DDR milestones and platform design 12/2009 Presentation
Memory Module Serial Presence-Detect: (PDF 505.83 KB)Describes how SPD is essential in helping to standardize the configuration, timing, and manufacturing information of memory modules TN-04-42 12/2009 Technical Note
Understanding Signal Integrity: (PDF 1.64 MB)Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life TN-00-20 12/2009 Technical Note
Proper Installation Procedures for Micron DIMMs: (PDF 419.89 KB) 12/2009 Module Handling Guide
Proper Installation of Micron DIMMs - Traditional Chinese: (PDF 758.93 KB) 12/2009 Module Handling Guide
Proper Installation of Micron DIMMs - Spanish: (PDF 546.81 KB) 12/2009 Module Handling Guide
Proper Installation of Micron DIMMs - Simplified Chinese: (PDF 592.58 KB) 12/2009 Module Handling Guide
Proper Installation of Micron DIMMs - Japanese: (PDF 394.2 KB) 12/2009 Module Handling Guide
Proper Handling Procedures for Micron DIMMs: (PDF 396.18 KB) 12/2009 Module Handling Guide
Proper Handling of Micron DIMMs - Traditional Chinese: (PDF 539.92 KB) 12/2009 Module Handling Guide
Proper Handling of Micron DIMMs - Spanish: (PDF 461.82 KB) 12/2009 Module Handling Guide
Proper Handling of Micron DIMMs - Japanese: (PDF 453.96 KB) 12/2009 Module Handling Guide
DRAM Module Form Factors: (PDF 435.56 KB)Compares the most common DRAM module form factors TN-04-55 09/2009 Technical Note
High-Speed DRAM Controller Design: (PDF 1 MB)Identifies and discusses five key areas of DRAM controller design TN-04-54 04/2008 Technical Note
Module Pinout Decoder: (PDF 215.46 KB)Provides sorted pin assignment tables and pin location figures for use in DDR2 DIMM signal identification, tracing, and troubleshooting TN-47-03 12/2004 Technical Note
Comparing Module Parameters: (PDF 52.71 KB)Compares module parameters. TN-04-49 03/2003 Technical Note
For Products and Support (14)
Title & Description Secure ID# Updated Type
Shipping Quantities: (PDF 1.22 MB)Provides standard part quantities for shipping. CSN-04 03/2014 Customer Service Note
RMA Procedures for Packaged Product and Bare Die Devices: (PDF 76.22 KB)Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs. CSN-07 01/2014 Customer Service Note
Product Marks/Product and Packaging Labels: (PDF 1.39 MB)Explains product part marking, and product and packaging labels. CSN-11 01/2014 Customer Service Note
Wafer Packaging and Packaging Materials: (PDF 591.42 KB)Provides complete shipping and recycling information about each of the materials used for shipping Micron's products. CSN-20 11/2013 Customer Service Note
Thermal Applications: (PDF 246.79 KB)Describes some considerations in thermal applications for Micron memory devices TN-00-08 07/2013 Technical Note
Moisture Absorption in Plastic Packages: (PDF 97.08 KB)Describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture TN-00-01 02/2013 Technical Note
Micron Component and Module Packaging: (PDF 1.41 MB)Explanation of Micron packaging labels and procedures. CSN-16 01/2013 Customer Service Note
Micron BGA Manufacturer's User Guide: (PDF 388.76 KB)Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices. CSN-33 12/2012 Customer Service Note
Electronic Data Interchange: (PDF 52.45 KB)Describes EDI transmission sets, protocol, and contacts. CSN-06 11/2012 Customer Service Note
PCN/EOL Systems: (PDF 79.21 KB)Explains Micron's product change notification and end-of-life systems. CSN-12 04/2012 Customer Service Note
Lead Frame Package User Guidelines: (PDF 245.66 KB)Discusses Micron's lead-frame package options CSN-30 05/2011 Customer Service Note
ESD Precautions for Die/Wafer Handling and Assembly: (PDF 120.81 KB)Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs. CSN-24 08/2010 Customer Service Note
Micron KGD Definitions: (PDF 65.52 KB)Describes the testing specifications and parameters for Micron's KGD-C1 and KGD-C2 DRAM die. CSN-22 07/2009 Customer Service Note
Bare Die SiPs and MCMs: (PDF 151.06 KB)Describes design considerations for bare die SiPs and MCMs. CSN-18 04/2009 Customer Service Note

Please Note: To view Secure Documents (Secure Lock) please log in or click on a secured document to request access.

DRAM Modules FAQs (5)

What is a "bank"?
A bank is an array of memory bits. Multiple arrays or banks are contained within a DRAM component. Depending on density, DRAM components may consist of 4 or 8 banks. For example, a bank may consist of 32 million rows, 4 bits across. This would equate to 128 megabits. Four of these banks in a single DRAM component would yield a 512Mb component.
What is the impedance tolerance of the driver in match-impedance mode relative to the expected value base on the perfect reference resistor connected to ZQ pin?
The impedance tolerance of the driver is ±15 percent.
Does thermal information change for IT parts?
Thermal information includes temperature limits and thermal impedance values. Temperature limits do change for IT parts (TC, TJ, and TA), but thermal impedance values (θJA, θJB, and θJC) do not because thermal impedance depends primarily on the package.
My design was based on a specification stating the JTAG was relative to VDD (1.8V), but now we’ve discovered that JTAG is actually relative to VDDQ (1.5V). It’s a fairly significant board spin to change this; what do I risk by leaving the design as-is? I assume that the specification is still for VDDQ + 0.3V = 1.8V, but with CMOS parts there’s no way I can guarantee that it won’t swing past that on transitions.
Your particular board design should not be a cause of major concern. The pins can handle the VDD voltage regardless of the VDDQ voltage.
Should the ECC memory chip share chip select and CKE signals with the other two main memory chips in our point-to-point application?
The ECC chip(s) should share the same CKE and CS# as the other devices because they are accessed as the same piece of data.

Products and Support FAQs (1)

Who do I contact if I have questions about my buymicron.com order?
If you have any questions about your order, contact buymicron.com.

Freescale Forum Attendees Score Free Micron TWRPI Modules

April 21, 2014 by Jim Cooke

Earlier this month, I attended the Freescale Technology Forum (FTF) at the Gaylord Conference Center in Dallas, TX. FTF is a unique networking and learning opportunity for embedded designers. Attendees gather in early April for Freescale president and CEO Gregg Lowe’s keynote address The “cherry on top” of this already information-rich conference came in the form of some pretty awesome &ldquo...Read More

See all posts on Modules, NOR, Data Center, USA

Latest Blog Posts

Accelerating System Bandwidth with Serial Memory Solutions Using Hybrid Memory Cube Technology

January 29, 2014 by

For over 4 years, Micron and Altera have been collaborating on HMC technologies. This ongoing work led to the industry’s first demonstration of a working HMC controller, announced last September...Read More


Micron's Chief Technologist Featured in EDN's Profiles in Design Series

January 28, 2014 by

Last week, our very own Tom Pawlowski was featured in EDN's Profiles in Design series leading up to his keynote address at this year's DesignCon. If you're planning to attend DesignCon at the Santa Cl...Read More