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At the heart of our VLP UDIMMs is the world’s most advanced DRAM technology—designed so that your router, hub, switch, or bridge can be faster, smaller, and much more reliable. In fact, our lower-height, ATCA-compliant VLP UDIMMs are specifically made to be stacked vertically--significantly improving airflow and reducing power consumption. Plus, they are compatible with existing sockets

By Density

Density Voltage Width Speed Op Temp Module Rank
8GB 1.35V, 1.5V x72 PC3-10600, PC3-12800 0C to +95C n/a, Dual Rank
4GB 1.5V, 1.35V x72 PC3-12800, PC3-10600 0C to +95C Single Rank, Dual Rank
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Stability and Longevity


Rely on long-term support as well as long transition times to new DRAM component shrinks.



Deliver improved airflow and reduce power consumption with components you can stack vertically.


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Micron Validated Memory

Title & Description Updated Type
Product Marks/Product and Packaging Labels (pdf) Explains product part marking, and product and packaging labels.
07/2015 Customer Service Note Add Email
Module Part Numbering Systems (pdf) Part numbering guides for Micron DDR4, DDR3, DDR, DDR, and SDRAM modules. 05/2015 Part Numbering Guide Add Email
DRAM Module Quick Reference Guide (pdf) Accelerate your time-to-market with quality DRAM modules rigorously tested for reliability in a wide range of applications--we have the right solution for your design. 02/2015 Product Flyer Add Email
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