VLP RDIMM

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Designed for Servers and Networking

Our VLP RDIMMs use up to 67% less board space than standard modules, making your design more compact, slashing thermal power consumption by improving airflow, and delivering the performance you need

server room

Save Square Footage in Your Data Center

More Compact Servers
Data centers are becoming increasingly more expensive, so fitting more servers into less space is vitally important. Our VLP RDIMMs take up less room on a board. Certainly, memory isn't the only component that contributes to a server's size, but designing in VLP RDIMMs helps save valuable space and money.


VLP RDIMM Part Catalog and Documentation

Better Airflow Saves Power
According to a study from the U.S. Environmental Protection Agency, keeping servers cool requires about 30 billion kWh annually in the United States alone. Improved airflow in servers could reduce cooling costs, saving data centers tens of millions of dollars, euros, pounds, and yen each year. Our VLP RDIMMs fit vertically on the board, which facilitates better airflow and increases reliability in heat-sensitive systems.

Vertically Mounted Modules for Better Airflow
Click the play button below to view how VLP memory modules save board space and improve airflow.
 
Improved Capacity
Micron’s high density, DDR , DDR2, and DDR3 VLP RDIMMs significantly boost overall telecom, networking, and computing blade server memory capacities while remaining compatible with existing RDIMM sockets. These VLP RDIMMs are available in 512MB-to-8GB densities.

Other Key Benefits
  • Extended Memory Capacity—High-density solutions eliminate memory capacity limits.
  • Fast Performance—Speeds up to 1333 MT/s.
  • Reliability and Compatibility—We employ stringent quality and reliability tests, and we work with chipset vendors to validate our modules.

Features Benefits
Densities 512MB-8GB Offers high densities and small form factors to fit server and low-profile applications—18.29mm (JEDEC) and 17.9mm (ATCA); this enables a 67% reduction in board space.
Configuration x72 Offers high densities and small form factors to fit server and low-profile applications—18.29mm (JEDEC) and 17.9mm (ATCA); this enables a 67% reduction in board space.
Supply Voltages 1.5V, 1.8V, 2.5V Reduced power consumption—a key advantage.
Speed Grade PC-2700-to-PC-10600 333 MT/s to 1333 MT/s for improved speeds.
Temperature Ranges 0°C to +70°C
0°C to +85°C
-40°C to +105°C		 Increased operating range for optimum functionality in extreme environments.
Special Features PLL
Simulation models		 Provides better signal integrity to each component on the module.
Our convenient thermal and electrical simulation models are available online for easy download.

Type Secure Title & Description ID# Updated Size
Thermal Applications:  Defines a general method and criteria for measuring and ensuring that Micron components and modules do not exceed the maximum allowable temperature TN-00-08 05/2010 252.18 KB
Recommended Soldering Parameters:  Defines the recommended soldering techniques and parameters for Micron Technology, Inc., products. TN-00-15 03/2007 69.09 KB
Uprating of Semiconductors for High-Temperature Applications:  Describes the issues associated with temperature uprating and the risks involved in using components and/or systems outside the manufacturer's environmental specifications TN-00-18 05/2010 428.33 KB
Understanding Signal Integrity:  Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life TN-00-20 12/2009 1.52 MB
Memory Module Serial Presence-Detect:  Describes how SPD is essential in helping to standardize the configuration, timing, and manufacturing information of memory modules TN-04-42 12/2009 505.83 KB
Comparing Module Parameters:  Compares module parameters. TN-04-49 03/2003 52.71 KB
High-Speed DRAM Controller Design:  Identifies and discusses five key areas of DRAM controller design TN-04-54 04/2008 1 MB
DRAM Module Form Factors:  Compares the most common DRAM module form factors TN-04-55 09/2009 435.56 KB
Module Pinout Decoder:  Provides sorted pin assignment tables and pin location figures for use in DDR2 DIMM signal identification, tracing, and troubleshooting TN-47-03 12/2004 215.46 KB
Module Part Numbering Systems:  Part numbering guides for Micron DDR4, DDR3, DDR, DDR, and SDRAM modules. 04/2012 50.52 KB
PCN/EOL Systems:  Explains Micron's product change notification and end-of-life systems. CSN-12 04/2012 79.21 KB
Wafer Packaging and Packaging Materials:  Provides complete shipping and recycling information about each of the materials used for shipping Micron's products. CSN-20 09/2011 776.24 KB
Bare Die SiPs and MCMs:  Describes design considerations for bare die SiPs and MCMs. CSN-18 04/2009 151.06 KB
Shipping Quantities:  Provides tables of part quantity. CSN-04 04/2012 472.27 KB
Micron KGD Definitions:  Describes the testing specifications and parameters for Micron's KGD-C1 and KGD-C2 DRAM die. CSN-22 07/2009 65.52 KB
Proper Handling Procedures for Modules:  Includes procedures for how to properly handle modules. CSN-23 12/2007 1.02 MB
Micron Component and Module Packaging:  Explanation of Micron packaging labels and procedures. CSN-16 02/2012 887.13 KB
ESD Precautions for Die/Wafer Handling and Assembly:  Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs. CSN-24 08/2010 119.08 KB
Electronic Data Interchange:  Describes EDI transmission sets, protocol, and contacts. CSN-06 09/2005 53.5 KB
RMA Procedures for Packaged Product and Bare Die Devices:  Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs. CSN-07 10/2010 82.64 KB
ISO System Management Standards:  Describes ISO system management standards. CSN-08 04/2004 39.18 KB
Competitive DDR Memory Subsystems:  DDR milestones and platform design 12/2009 2.64 MB
DDR System Design Considerations:  DDR overview 12/2009 3.46 MB
The Future of Memory and Storage:  Overview of trends for main memory and Flash memory 12/2009 1.54 MB
Design Guide for Two DDR3-1066 UDIMM Systems:  Rev. B, Design guide to assist board designers implementing products using UDIMM systems TN-41-08 01/2010 1.1 MB
Moisture Absorption in Plastic Packages:  Describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture TN-00-01 02/2010 87.26 KB
Accelerate Design Cycles with Simulation Models:  Micron supplies the tools and guidelines necessary to verify new designs prior to layout. This technical note discusses software model support, signal integrity optimization, and logic circuit design. TN-00-09 02/2010 206.91 KB
Micron Wire-Bonding Techniques:  This technical note provides guidance on wire bonding techniques for both nickel-palladium (NiPd) and aluminum (Al) bond pads on Micron products. TN-00-22 11/2010 66.13 KB
Micron BGA Manufacturer's User Guide:  Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices. CSN-33 07/2011 353.32 KB
Proper Handling Procedures for Micron DIMMs:  12/2009 396.18 KB
Proper Installation Procedures for Micron DIMMs:  12/2009 419.89 KB
Proper Handling of Micron DIMMs - Japanese:  12/2009 453.96 KB
Proper Installation of Micron DIMMs - Japanese:  12/2009 394.2 KB
Proper Handling of Micron DIMMs - Simplified Chinese:  12/2009 482.47 KB
Proper Installation of Micron DIMMs - Simplified Chinese:  12/2009 592.58 KB
Proper Handling of Micron DIMMs - Spanish:  12/2009 461.82 KB
Proper Installation of Micron DIMMs - Spanish:  12/2009 546.81 KB
Proper Handling of Micron DIMMs - Traditional Chinese:  12/2009 539.92 KB
Proper Installation of Micron DIMMs - Traditional Chinese:  12/2009 758.93 KB
Product Marks/Product and Packaging Labels:  Explains product part marking, and product and packaging labels. CSN-11 04/2012 724.89 KB
Bypass Capacitor Selection for High-Speed Designs:  Describes bypass capacitor selection for high-speed designs. TN-00-06 03/2011 481.9 KB
DDR2 VLP Modules:  11/2007 86.88 KB

Please Note: To view Secure Documents (Secure Lock) please log in or click on a secured document to request access.

Is there a set of trace lengths and routing rules that are standard for use when designing a system that uses a specific module technology and form factor?
No. A robust memory subsystem design that includes the use of one or more memory modules must be simulated in order to determine the optimum trace lengths and terminations. However, our design guides such as TN-47-01 and TN-41-08 have some best practices and design examples based on some typical system assumptions. This information does not define the only way your system can be designed; it is a starting point and, moreover, an example of steps that can be taken to determine the best design for your system.
Can Vtt and Vref be supplied by the same supply in my system design?
With proper decoupling, this can be an acceptable design. However, Micron recommends separating all supplies. VREF tends to have more noise on it because it supplies signals that are regularly switching. A robust design typically would not connect these supplies due to the possibility of introducing this noise onto the VTT plane, which should be as stable as possible. Additionally, VREF requires much less current than VTT.

VLP RDIMM

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