Can Vtt and Vref be supplied by the same supply in my system design?
With proper decoupling this can be an acceptable design. However, Micron recommends ensuring all supplies are separated. Vref tends to have more noise on it because it supplies signals that are regularly switching. A robust design would typically not connect these supplies due to the possibility of introducing this noise onto the Vtt plane which should be as stable as possible. Additionally, Vref requires much less current than Vtt.
Is there a set of trace lengths and routing rules that are standard for use when designing a system that uses a specific module technology and form factor?
No. A robust memory subsystem design that includes the use of 1 or more memory modules must be simulated in order to determine the optimum trace lengths, terminations. However, our design guides such as TN-47-01
have some best practices and design examples based on some typical system assumptions. This information is not meant to be the only way your system can be designed. It is a starting point and moreover an example of the steps used to determine the best design for your system.
What is the value of Single-Sided SODIMMs?
Single-Sided SODIMMs have DRAM on one side only, reducing overall height by 35%, which is ideal for the sleek profile of ultrathin systems. Additionally, Micron’s Single-Sided SODIMMs come with 30nm 4Gb 1600 DDR3L-RS components onboard, reducing power consumption in standby and extending device battery life.
Will this be a replacement for standard SODIMMs?
No, Single-Sided SODIMMs represent the latest form factor in Micron’s portfolio of DRAM solutions targeted at ultrathin applications and offers additional system design flexibility.
How were you able to reduce the z-height by 35%?
We placed the DRAM components, capacitors, and resistors on either the front or back side of the module, but not both.
How does this product compare to your competition in the DDR3 market?
Our competition offers a wide range of products; however, our Single-Sided SODIMM solution not only offers a reduced z-height, but reduces standby power as well because it’s populated with DDR3L-RS, our reduced standby PC DRAM.
What is the role of TE Connectivity?
The new connector from TE is designed to accept Micron’s Single-Sided DDR3 SODIMM, enabling a reliable interconnection for this reduced-height memory module. Offered in the usual standard and reverse type, the new connector also includes a corner key to ensure that double-sided modules are not inserted. The connector also reduces motherboard shadow area by almost 70mm2 or 140mm2 for the usual dual-socket implementation using both a standard and reverse type connector and module.
Can you elaborate on dates these products will be available to customers?
Samples of Micron’s Single-Sided DDR3 SODIMMs are available now and production is slated for Spring 2013.
What other products do you have in your portfolio that match up with the tablet and ultrathin client markets?
Micron carries one of the most diverse memory product portfolios in the industry—from SPI NOR and SSD solutions, to DDR3L-RS, LPDDR3, and DDR4 products.