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Bridging the Gap Between DRAM Speed and NAND Nonvolatility

Nonvolatile DIMM (NVDIMM) technology fills the memory performance gap between DRAM and NAND—combining the speed of DRAM with the persistent storage of NAND for increased system performance and reliability.

NVDIMMs are an RDIMM form factor that merges NAND Flash, DRAM, and an ultracapacitor power source into a memory subsystem—delivering DRAM read/write performance and backing up its data if power is interrupted.

NVDIMMs provide performance, cost, and data security advantages for a wide range of enterprise-class server and storage applications. They are ideal for environments that need persistent DRAM capability to optimize frequent access to big data’s complex information sets.

They’re also eco-friendly—while batteries start to lose their ability to hold a charge after several hundred charge/discharge cycles, the ultracaps used in NVDIMMs have hundreds of thousands of cycles, greatly extending their life. And unlike many batteries, ultracaps are lead-free and not prone to leaking.

NVDIMM Alliance

We’ve partnered with other industry experts—like AgigA Tech, Intel, Samsung, SK hynix, and Microsoft—to form SNIA’s NVDIMM Special Interest Group (SIG). Our goal is to help communicate the benefits of NVDIMMs more broadly, to educate customers on how to design in NVDIMMs efficiently, and to make it easy for customers to find the products that integrate with NVDIMMs.

Topics Relating to NVDIMM
Data Center

Data Center

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  • Provides persistence to server RAID storage, storage cache tiering, data logging, de-duplication, system/application checkpoints, and metadata storage
  • Preserves critical data in the event of power loss
  • Eliminates the need to create a separate memory subsystem for emergency cache backup
  • Accelerates business application speeds by increasing hot data performance
  • Cost-effective and power-efficient ultracapacitor eliminates the need for batteries and improves TCO compared to batteries or a UPS
  • Integrates into standard x86 server and storage architectures
  • Incorporates eco-friendly Pb-free ultracapacitors

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Serial Presence Detect Tool

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For NVDIMM (2)
Title & Description Secure ID# Updated Type
NVDIMMs: Fast, Reliable, Persistent Access to Metadata: (PDF 207.06 KB) Micron’s new NVDIMM technology combines the speed of DRAM with the persistent storage of NAND to improve and sustain system performance and reliability. 06/2014 Product Flyer
Micron Validated Memory: The Module Search Tool can be used in conjunction with the sections below to find information on Micron validated DDR3 SDRAM modules. Tool
For DRAM Modules (30)
Title & Description Secure ID# Updated Type
DRAM for Every Design: Micron DRAM Module Form Factors Quick Reference Guide: (PDF 93.24 KB)Accelerate your time-to-market with quality DRAM modules rigorously tested for reliability in a wide range of applications. From the cost-sensitive needs of consumer computing to the extreme temperature and performance needs of industrial applications to the exacting specifications of enterprise systems, we have the right solution for your design. 10/2014 Product Flyer
Module Part Numbering Systems: (PDF 86.07 KB)Part numbering guides for Micron DDR4, DDR3, DDR, DDR, and SDRAM modules. 10/2014 Part Numbering Guide
Routing Guidelines for Micron’s HMC-15G-SR: (PDF 3.3 MB)Provides sound methods, proven solutions, and detailed PCB layout guidelines to enable successful designs using Micron’s HMC. TN-43-03 HMC TN-43-03 06/2013 Technical Note
Proper Handling Procedures for Modules and SSDs: (PDF 1.02 MB)Includes procedures for how to properly handle modules and SSDs. CSN-23 05/2013 Customer Service Note
DDR3 Networking Module Summary: (PDF 185.18 KB) 01/2013 Other Documents
Recommended Soldering Parameters: (PDF 173.37 KB)Defines the recommended soldering techniques and parameters for Micron Technology, Inc., products. TN-00-15 12/2012 Technical Note
Bypass Capacitor Selection for High-Speed Designs: (PDF 481.9 KB)Describes bypass capacitor selection for high-speed designs. TN-00-06 03/2011 Technical Note
Micron Wire-Bonding Techniques: (PDF 66.13 KB)This technical note provides guidance on wire bonding techniques for both nickel-palladium (NiPd) and aluminum (Al) bond pads on Micron products. TN-00-22 11/2010 Technical Note
Uprating of Semiconductors for High-Temperature Applications: (PDF 428.33 KB)Describes the issues associated with temperature uprating and the risks involved in using components and/or systems outside the manufacturer's environmental specifications TN-00-18 05/2010 Technical Note
Accelerate Design Cycles with Simulation Models: (PDF 206.91 KB)Micron supplies the tools and guidelines necessary to verify new designs prior to layout. This technical note discusses software model support, signal integrity optimization, and logic circuit design. TN-00-09 02/2010 Technical Note
Design Guide for Two DDR3-1066 UDIMM Systems: (PDF 1.1 MB)Rev. B, Design guide to assist board designers implementing products using UDIMM systems TN-41-08 01/2010 Technical Note
The Future of Memory and Storage: (PDF 1.54 MB)Overview of trends for main memory and Flash memory 12/2009 Presentation
DDR System Design Considerations: (PDF 3.46 MB)DDR overview 12/2009 Presentation
Competitive DDR Memory Subsystems: (PDF 2.64 MB)DDR milestones and platform design 12/2009 Presentation
Memory Module Serial Presence-Detect: (PDF 505.83 KB)Describes how SPD is essential in helping to standardize the configuration, timing, and manufacturing information of memory modules TN-04-42 12/2009 Technical Note
Understanding Signal Integrity: (PDF 1.64 MB)Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life TN-00-20 12/2009 Technical Note
Proper Installation Procedures for Micron DIMMs: (PDF 419.89 KB) 12/2009 Module Handling Guide
Proper Installation of Micron DIMMs - Traditional Chinese: (PDF 758.93 KB) 12/2009 Module Handling Guide
Proper Installation of Micron DIMMs - Spanish: (PDF 546.81 KB) 12/2009 Module Handling Guide
Proper Installation of Micron DIMMs - Simplified Chinese: (PDF 592.58 KB) 12/2009 Module Handling Guide
Proper Installation of Micron DIMMs - Japanese: (PDF 394.2 KB) 12/2009 Module Handling Guide
Proper Handling Procedures for Micron DIMMs: (PDF 396.18 KB) 12/2009 Module Handling Guide
Proper Handling of Micron DIMMs - Traditional Chinese: (PDF 539.92 KB) 12/2009 Module Handling Guide
Proper Handling of Micron DIMMs - Spanish: (PDF 461.82 KB) 12/2009 Module Handling Guide
Proper Handling of Micron DIMMs - Japanese: (PDF 453.96 KB) 12/2009 Module Handling Guide
DRAM Module Form Factors: (PDF 435.56 KB)Compares the most common DRAM module form factors TN-04-55 09/2009 Technical Note
High-Speed DRAM Controller Design: (PDF 1 MB)Identifies and discusses five key areas of DRAM controller design TN-04-54 04/2008 Technical Note
Module Pinout Decoder: (PDF 215.46 KB)Provides sorted pin assignment tables and pin location figures for use in DDR2 DIMM signal identification, tracing, and troubleshooting TN-47-03 12/2004 Technical Note
Comparing Module Parameters: (PDF 52.71 KB)Compares module parameters. TN-04-49 03/2003 Technical Note
Serial Presence Detect : Micron’s SPD data conforms to JEDEC industry standards and is available through Micron’s SPD tool with your Micron module part number. Tool
For Products and Support (14)
Title & Description Secure ID# Updated Type
Product Marks/Product and Packaging Labels: (PDF 1.58 MB)Explains product part marking, and product and packaging labels. CSN-11 10/2014 Customer Service Note
Shipping Quantities: (PDF 1.22 MB)Provides standard part quantities for shipping. CSN-04 03/2014 Customer Service Note
RMA Procedures for Packaged Product and Bare Die Devices: (PDF 76.22 KB)Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs. CSN-07 01/2014 Customer Service Note
Wafer Packaging and Packaging Materials: (PDF 591.42 KB)Provides complete shipping and recycling information about each of the materials used for shipping Micron's products. CSN-20 11/2013 Customer Service Note
Thermal Applications: (PDF 246.79 KB)Describes some considerations in thermal applications for Micron memory devices TN-00-08 07/2013 Technical Note
Moisture Absorption in Plastic Packages: (PDF 97.08 KB)Describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture TN-00-01 02/2013 Technical Note
Micron Component and Module Packaging: (PDF 1.41 MB)Explanation of Micron packaging labels and procedures. CSN-16 01/2013 Customer Service Note
Micron BGA Manufacturer's User Guide: (PDF 388.76 KB)Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices. CSN-33 12/2012 Customer Service Note
Electronic Data Interchange: (PDF 52.45 KB)Describes EDI transmission sets, protocol, and contacts. CSN-06 11/2012 Customer Service Note
PCN/EOL Systems: (PDF 79.21 KB)Explains Micron's product change notification and end-of-life systems. CSN-12 04/2012 Customer Service Note
Lead Frame Package User Guidelines: (PDF 245.66 KB)Discusses Micron's lead-frame package options CSN-30 05/2011 Customer Service Note
ESD Precautions for Die/Wafer Handling and Assembly: (PDF 120.81 KB)Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs. CSN-24 08/2010 Customer Service Note
Micron KGD Definitions: (PDF 65.52 KB)Describes the testing specifications and parameters for Micron's KGD-C1 and KGD-C2 DRAM die. CSN-22 07/2009 Customer Service Note
Bare Die SiPs and MCMs: (PDF 151.06 KB)Describes design considerations for bare die SiPs and MCMs. CSN-18 04/2009 Customer Service Note

Please Note: To view Secure Documents (Secure Lock) please log in or click on a secured document to request access.

NVDIMM FAQs (9)

What is pricing for NVDIMMs?

Please contact your local sales or distribution contact for pricing guidance. Visit the How To Buy page for assistance in locating an authorized distributor or Micron sales representative.

What advantages does Micron offer over the competition?

Micron is the only supplier with the advantages of scale and stability. Micron produces DRAM, NAND, and NOR products, all which are used on the NVDIMM.

What is Micron’s relationship with AgigA Tech?

Micron has teamed up with AgigA Tech to co-develop several versions of NVDIMMs. Micron will manufacture the NVDIMM and rely on AgigA Tech to provide the PowerGem® ultracapacitor (or ultracap) modules that supply power to the NVDIMM during a power-fail event.

Are there any special design requirements for NVDIMMs?

NVDIMMs are designed to integrate easily into the DIMM slots of industry-standard server and storage platforms. The Save function can be initiated in several ways; to initiate a Save by the defined ADR pin, the NVDIMM must be paired with a motherboard that supports this hardware function.

What are the target applications?

Storage tiering, cache for RAID systems, system checkpointing, full system persistence, data logging, de-duplication, and fast access to metadata.

What densities will Micron offer?

Initial offerings are 4GB/8GB (DRAM/NAND) and 8GB/16GB (DRAM/NAND). 16GB of DRAM with 32GB of NAND is planned for later in 2013.

What is NVDIMM technology?

A nonvolatile DIMM (NVDIMM) is a type of hybrid module that merges NAND Flash, DRAM, and an ultracapacitor (also called ultracap or supercapacitor) power source into a highly reliable nonvolatile memory system. NVDIMMs can be used in the main memory slots of servers to perform workloads at DRAM speeds, yet in the event of a power failure or system crash, the data in the NVDIMM is securely preserved in the NAND and is available almost immediately upon power restoration to the host system.

What is the advantage of using an ultracapacitor over a traditional power source?

Ultracapacitors (also known as ultracaps or supercapacitors) store electricity by physically separating positive and negative charges—unlike batteries, which do so chemically. Because ultracapacitors do not rely on a chemical reaction, they can operate in a wide variety of conditions. Also, whereas batteries start to lose their ability to hold a charge after a year or two (several hundred charge/discharge cycles), ultracapacitors have hundreds of thousands of charge/discharge cycles, which greatly extends their life compared to a battery. Unlike many batteries, ultracapacitors do not contain lead and do not have leaking problems.

What is the specific value these NVDIMM products deliver?

NVDIMM technology provides performance, cost, and data-security advantages by:

  • Eliminating the need to create a separate memory subsystem for emergency cache backup
  • Increasing the application speeds
  • Reducing access to storage that is slower than DRAM speeds; for example, SSDs or hard drives
  • Eliminating the need for batteries by using a more cost-effective and power-efficient ultracapacitor (ultracap)
  • Provides persistence to server RAID storage, storage cache tiering, data logging, de-duplication, system/application checkpoints, and metadata storage
  • NVDIMMs fill a hole in the storage continuum between DRAM modules and PCI SSD. NVDIMMs provide significant performance at a favorable cost/bit compared to other technologies.

DRAM Modules FAQs (5)

What is a "bank"?
A bank is an array of memory bits. Multiple arrays or banks are contained within a DRAM component. Depending on density, DRAM components may consist of 4 or 8 banks. For example, a bank may consist of 32 million rows, 4 bits across. This would equate to 128 megabits. Four of these banks in a single DRAM component would yield a 512Mb component.
What is the impedance tolerance of the driver in match-impedance mode relative to the expected value base on the perfect reference resistor connected to ZQ pin?
The impedance tolerance of the driver is ±15 percent.
Does thermal information change for IT parts?
Thermal information includes temperature limits and thermal impedance values. Temperature limits do change for IT parts (TC, TJ, and TA), but thermal impedance values (θJA, θJB, and θJC) do not because thermal impedance depends primarily on the package.
My design was based on a specification stating the JTAG was relative to VDD (1.8V), but now we’ve discovered that JTAG is actually relative to VDDQ (1.5V). It’s a fairly significant board spin to change this; what do I risk by leaving the design as-is? I assume that the specification is still for VDDQ + 0.3V = 1.8V, but with CMOS parts there’s no way I can guarantee that it won’t swing past that on transitions.
Your particular board design should not be a cause of major concern. The pins can handle the VDD voltage regardless of the VDDQ voltage.
Should the ECC memory chip share chip select and CKE signals with the other two main memory chips in our point-to-point application?
The ECC chip(s) should share the same CKE and CS# as the other devices because they are accessed as the same piece of data.

Products and Support FAQs (1)

Who do I contact if I have questions about my buymicron.com order?
If you have any questions about your order, contact buymicron.com.

NVDIMMs—The Best of Both Worlds

February 6, 2013 by Brett Williams

The NVDIMM is a new “hybrid” memory module that combines the speed of DRAM with the nonvolatility of NAND Flash. NVDIMMs enable the content in DRAM to be saved into the NAND Flash based on a signal from the system. This signal could indicate power failure or any other event when you’d want DRAM content to move into the NAND, such as system checkpoints, data logging, saving metadata, etc. NVDIMMs provide performance, cost, and data-security advantages for enterprise-class serve...Read More

See all posts on Modules, DRAM, NAND

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