Mini-DIMM

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Mini-DIMMS: Great Signal Integrity in a Small Module

Our DDR2 and DDR3 Mini-DIMMs are available in a range of densities and configurations to suit a variety of designs. All of our Mini-DIMMs come with ECC to ensure the data integrity that helps make them the foundation for reliable high performance in networking platforms.

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Built for Networking

A Networking-Specific Solution
With our Mini-DIMMs, you get all the benefits of our DRAM design and manufacturing expertise plus our high-quality test methodology—enabling you to design smaller form factor routers, switches, bridges, and hubs that can deliver peak performance.


Mini-DIMM Part Catalog and Documentation


ECC for Excellent Data Integrity
All of our Mini-DIMMs feature built-in ECC to ensure reliably high data integrity. Registered versions also include address parity, which provides additional performance for systems where data accuracy is especially critical. Address parity is supported by some controllers and goes a step further than ECC by allowing the system designer to verify the accuracy of the address lines to the module.

Industry-Leading Quality
We develop and build high-quality networking modules, managing the module manufacturing process from beginning to end. We design with leading-edge DRAM and work with board makers and industry organizations. We carefully test components, packaging, and modules. Our involvement at every stage of memory development and manufacture ensures you'll consistently receive top-quality Mini-DIMMs.

Features Benefits
Wide Density Range With many density choices in a small form factor, you can build powerful devices in a limited amount of space
Flexible Configuration Available as registered or unbuffered* in single- or dual-rank configurations (*UDIMMs in DDR3 only)
ECC ECC bits to support error handling and correction for increased data reliability
Optional PLL and Buffer Reduces the load on the memory controller, which ensures signal integrity and enables the system to accommodate the maximum number of modules
Simulation Models Our convenient thermal and electrical simulation models are available online for easy download

Type Secure Title & Description ID# Updated Size
Thermal Applications:  Defines a general method and criteria for measuring and ensuring that Micron components and modules do not exceed the maximum allowable temperature TN-00-08 05/2010 252.18 KB
Recommended Soldering Parameters:  Defines the recommended soldering techniques and parameters for Micron Technology, Inc., products. TN-00-15 03/2007 69.09 KB
Uprating of Semiconductors for High-Temperature Applications:  Describes the issues associated with temperature uprating and the risks involved in using components and/or systems outside the manufacturer's environmental specifications TN-00-18 05/2010 428.33 KB
Understanding Signal Integrity:  Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life TN-00-20 12/2009 1.52 MB
Memory Module Serial Presence-Detect:  Describes how SPD is essential in helping to standardize the configuration, timing, and manufacturing information of memory modules TN-04-42 12/2009 505.83 KB
Comparing Module Parameters:  Compares module parameters. TN-04-49 03/2003 52.71 KB
High-Speed DRAM Controller Design:  Identifies and discusses five key areas of DRAM controller design TN-04-54 04/2008 1 MB
DRAM Module Form Factors:  Compares the most common DRAM module form factors TN-04-55 09/2009 435.56 KB
Module Pinout Decoder:  Provides sorted pin assignment tables and pin location figures for use in DDR2 DIMM signal identification, tracing, and troubleshooting TN-47-03 12/2004 215.46 KB
Module Part Numbering Systems:  Part numbering guides for Micron DDR4, DDR3, DDR, DDR, and SDRAM modules. 04/2012 50.52 KB
PCN/EOL Systems:  Explains Micron's product change notification and end-of-life systems. CSN-12 04/2012 79.21 KB
Wafer Packaging and Packaging Materials:  Provides complete shipping and recycling information about each of the materials used for shipping Micron's products. CSN-20 09/2011 776.24 KB
Bare Die SiPs and MCMs:  Describes design considerations for bare die SiPs and MCMs. CSN-18 04/2009 151.06 KB
Shipping Quantities:  Provides tables of part quantity. CSN-04 04/2012 472.27 KB
Micron KGD Definitions:  Describes the testing specifications and parameters for Micron's KGD-C1 and KGD-C2 DRAM die. CSN-22 07/2009 65.52 KB
Proper Handling Procedures for Modules:  Includes procedures for how to properly handle modules. CSN-23 12/2007 1.02 MB
Micron Component and Module Packaging:  Explanation of Micron packaging labels and procedures. CSN-16 02/2012 887.13 KB
ESD Precautions for Die/Wafer Handling and Assembly:  Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs. CSN-24 08/2010 119.08 KB
Electronic Data Interchange:  Describes EDI transmission sets, protocol, and contacts. CSN-06 09/2005 53.5 KB
RMA Procedures for Packaged Product and Bare Die Devices:  Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs. CSN-07 10/2010 82.64 KB
ISO System Management Standards:  Describes ISO system management standards. CSN-08 04/2004 39.18 KB
Competitive DDR Memory Subsystems:  DDR milestones and platform design 12/2009 2.64 MB
DDR System Design Considerations:  DDR overview 12/2009 3.46 MB
The Future of Memory and Storage:  Overview of trends for main memory and Flash memory 12/2009 1.54 MB
Design Guide for Two DDR3-1066 UDIMM Systems:  Rev. B, Design guide to assist board designers implementing products using UDIMM systems TN-41-08 01/2010 1.1 MB
Moisture Absorption in Plastic Packages:  Describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture TN-00-01 02/2010 87.26 KB
Accelerate Design Cycles with Simulation Models:  Micron supplies the tools and guidelines necessary to verify new designs prior to layout. This technical note discusses software model support, signal integrity optimization, and logic circuit design. TN-00-09 02/2010 206.91 KB
DDR3 Mini-DIMMs – Register Not Always Required:  Explanation of why DDR3 Mini-UDIMMs are the best choice for systems that don't actually require registered DIMMs. TN-41-10 04/2010 225.12 KB
Micron Wire-Bonding Techniques:  This technical note provides guidance on wire bonding techniques for both nickel-palladium (NiPd) and aluminum (Al) bond pads on Micron products. TN-00-22 11/2010 66.13 KB
Micron BGA Manufacturer's User Guide:  Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices. CSN-33 07/2011 353.32 KB
Proper Handling Procedures for Micron DIMMs:  12/2009 396.18 KB
Proper Installation Procedures for Micron DIMMs:  12/2009 419.89 KB
Proper Handling of Micron DIMMs - Japanese:  12/2009 453.96 KB
Proper Installation of Micron DIMMs - Japanese:  12/2009 394.2 KB
Proper Handling of Micron DIMMs - Simplified Chinese:  12/2009 482.47 KB
Proper Installation of Micron DIMMs - Simplified Chinese:  12/2009 592.58 KB
Proper Handling of Micron DIMMs - Spanish:  12/2009 461.82 KB
Proper Installation of Micron DIMMs - Spanish:  12/2009 546.81 KB
Proper Handling of Micron DIMMs - Traditional Chinese:  12/2009 539.92 KB
Proper Installation of Micron DIMMs - Traditional Chinese:  12/2009 758.93 KB
Product Marks/Product and Packaging Labels:  Explains product part marking, and product and packaging labels. CSN-11 04/2012 724.89 KB
Bypass Capacitor Selection for High-Speed Designs:  Describes bypass capacitor selection for high-speed designs. TN-00-06 03/2011 481.9 KB

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