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Your Innovation, Our Memory

Your Innovation, Our Memory

Emerging technologies require innovation on a whole new scale. See how we partner closely with our customers to gain unique insights about how we can optimize our memory solutions to enable your innovations—and help you change the world.

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Memory for Automotive

Memory for Automotive

Technology is reshaping the concept of driving. Automakers are developing countless new driver-assistance features and systems. See how Micron’s memory solutions are helping to enable these new supercomputing capabilities.

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About Micron

Where there's memory, there's Micron

Engineered for Innovation

For more than 30 years Micron has redefined innovation by designing, developing, and manufacturing some of the world’s most advanced technologies.

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Elpida is Now Micron

Elpida Is Now Micron

With the combined strength of our products, technology, and team members—our customers now have access to the broadest portfolio of best-in-class technology.

About the acquisition

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  • Save part pages
  • Save Data Sheets and other files
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My Folders

Your workspace is your area to organize and save part pages, data sheets, and links for easy access in the future. You can even start by saving some of the pages you've recently accessed below:

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My Workspace

Your Perfect DRAM Solutions

High-density, high-performance SDR, DDR, DDR3, and DDR4 DRAM components rigorously tested for use in industrial, automotive, enterprise, and computing systems.

Overview Benefits Densities Configurations Supply Voltages
  • High performance
  • Improved power savings
  • Increased data rates
  • Faster burst accesses
4Gb x4, x8, x16 1.2V
  • Enables large memory subsystems
  • Increased power efficiency
  • High performance
  • Increased bandwidth
1Gb–4Gb x4, x8, x16 1.35V, 1.5V
  • Enables large memory subsystems
  • Low-voltage, energy-efficient options
  • Extended operating temperatures
256Mb–4Gb x4, x8, x16 1.55V, 1.8V
  • Extended operating temperatures
  • JEDEC-compliant
256Mb–1Gb x4, x8, x16 2.5, 2.6V
  • Extended operating temperatures 
  • JEDEC-compliant 
  • Easy-to-implement 
64Mb–512Mb x4, x8, x16, x32 3.3V
  • Ultra-high memory bandwidth
  • High performance
  • System stability
  • x32/x16 operation
2Gb–4Gb x32 1.5V
  • High-performance
  • Ultra-low bus turnaround time enables higher sustainable bandwidth
  • Ideal choice for packet buffering and inspections
    • Extended operating temperatures
288Mb, 576Mb, 1Gb x9, x18, x36 1.8V core; 1.5V or 1.8V I/O
  • Available in multiple technologies: LPSDR, LPDDR, LPDDR2, and LPDDR3
  • Low standby current and low self refresh for extended battery life
  • Temperature-compensated self refresh (TCSR) and partial-array self refresh (PASR) modes



x16, x32, x64 1.2V–3.3V
  • Low power consumption, high speed read and write function
  • Compatible with the standard wireless Flash interface
  • Temperature-compensated refresh (TCR) and partial-array refresh (PAR)
16–128Mb x16 1.7–1.95V core
1.7–3.3V I/O
1.7–3.6V I/O