Overview

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Your Innovation, Our Memory

Your Innovation, Our Memory

Emerging technologies require innovation on a whole new scale. See how we partner closely with our customers to gain unique insights about how we can optimize our memory solutions to enable your innovations—and help you change the world.

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Memory for Automotive

Memory for Automotive

Technology is reshaping the concept of driving. Automakers are developing countless new driver-assistance features and systems. See how Micron’s memory solutions are helping to enable these new supercomputing capabilities.

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About Micron

Where there's memory, there's Micron

Engineered for Innovation

For more than 30 years Micron has redefined innovation by designing, developing, and manufacturing some of the world’s most advanced technologies.

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Elpida is Now Micron

Elpida Is Now Micron

With the combined strength of our products, technology, and team members—our customers now have access to the broadest portfolio of best-in-class technology.

About the acquisition

Welcome to My Workspace!

Create an account to access these benefits:

  • Save part pages
  • Save Data Sheets and other files
  • Create folders to organize your projects
  • Share folders with colleagues
  • Organize secure documents for easy access
  • "Follow" parts to see alerts and updates

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My Folders

Your workspace is your area to organize and save part pages, data sheets, and links for easy access in the future. You can even start by saving some of the pages you've recently accessed below:

Bare Die Standard Page Save
My Workspace

Bare Die and Wafer Level Products

Requirements for smaller form factors and higher memory densities are fueling the need for bare die memory solutions due to their superior flexibility. Wafer-level products can be used in packaging technologies such as systems-in-a-package (SIPs) and multi-chip packages (MCPs) to reduce the board area required. With reduced trace lengths between devices, bare-die-based solutions also enable higher-frequency operation as processor and bus speeds increase. These benefits can come at a cost, however. Because the poorest performing die in the stack determines the quality of an MCP, it is important that you not be forced to scrap expensive devices due to a nonfunctioning or unreliable part. Micron is committed to delivering bare die products that maintain reliability and quality levels similar to fully tested and burned-in packaged devices.

Need More Information on our Wafer-Level Products?

Micron’s Bare Die Secure documents are designed to enable you to choose the wafer-level products that best meet your needs. This information takes the form of data sheets, technical notes, customer service notes, presentations, and simulation models.

Micron's bare die data sheets provide the information you need: X/Y coordinates with "street" widths; die dimensions; bonding instructions; and storage and care guidelines.

Requesting Access to Bare Die

Because of the sensitivity of this information, access to Bare Die secure documents is granted on an individual basis. To obtain access, you must first set up a micron.com account. Once you have an account, it only takes a few minutes to request access.

Accessing Bare Die Documents

If you already have access to Bare die documents, simply go to your My Account page and view My Sites to download the files.

Ordering Wafer-Level Products

For more information about ordering Micron bare die products directly from Micron, please contact us.