At Micron we’re always working on new memory device designs that improve performance. Right now we’re involved in a project with our JEDEC partners to standardize a new DRAM interface and die-stacking technology called three-dimensional stacking, or 3DS.
The idea behind 3DS is to use specially designed and manufactured master-and-slave DRAM die, with only the master die interfacing with the external memory controller. 3DS technology uses optimized DRAM die, single DLL per stack, reduced active ...
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