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Bare Die FAQs

Solutions
Bare Die(3)
Does Micron offer product in whole wafer form and singulated die?

Nearly all Micron memory die shipments are now sold as whole wafers, not singulated die (check with your local sales contact for availability). Wafer maps are provided in each wafer shipment. For more information on wafer mapping, see TN-00-21. (For information regarding Aptina image sensor die orders, see aptina.com)

How does Micron ship bare die product?

Micron die are provided as whole wafers and are shipped in horizontal wafer shippers ("coin stacks") or vendor boxes. Customers must have a clean room environment to store and unpack Micron wafers. For more information, see CSN 20: Whole Wafer Packaging.

What wafer thickness options does Micron offer?
Standard "unground" wafer thickness is 750µm for 200mm wafers and 790µm for 300mm wafers. Micron offers additional wafer thickness options for 200mm wafers, depending on the product. Please see the applicable die data sheet for die thickness options beyond the standard thickness. Depending on customer demand, Micron may consider processing alternative thicknesses. Please consult your sales representative for more information.