MCP is multichip package that contains multiple die and can be used by any controller. PoP is a form of an MCP made specifically to stack on top of a processor that has pads on the top side that mate to the ballout of the PoP. Because the PoP package stacks right on top of the processor, it eliminates the need to have traces routed on the PCB and provides better signal integrity. A variety of PoP packages are designed for various processors. PoP and MCP devices give designers the ability to take advantage of z space and to provide the flexibility to offer different logic in one package (for example, NAND + Mobile LPDDR or e.MMC™ + NAND + Mobile LPDDR). We have a wide selection of offerings to meet our customer’s needs.