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e.MMC FAQs

Managed NAND
eMMC(14)
What is e.MMC?

Embedded MultiMediaCard (e.MMC) is a NAND Flash-based memory solution defined by JEDEC that comes in a small BGA package. JEDEC defines both the hardware and software, enabling easy customer design-in and the ability to multisource.

What are the benefits of e.MMC?

e.MMC is a fully managed solution (all media management and ECC are handled internally), making NAND technology transitions invisible to the host and providing customers with the ability to reduce their time-to-market and to sustain products longer and more easily.

What does the term "broad market" signify?

Our embedded market e.MMC products are divided into two families: automotive and broad market. This is due to the unique requirements that are required in the automotive market; thus, there is a separate product line supported by Micron’s automotive team. Broad market covers all other market segments such as consumer, gaming, server, networking, industrial, medical, military, etc. Broad market e.MMC includes two sub-families: WT with commercial temperature grade and IT with an extended temperature range.

How can I order samples?

You can order samples through the Micron Sample Center.

Is it necessary to refer to the JEDEC specification as well as to Micron’s data sheet?

Yes, the JEDEC specification has to be read in conjunction with the data sheet. Micron e.MMC complies with the JEDEC standard; hence, Micron's data sheets provide information that is specific only to Micron’s e.MMC devices.


Are simulation models available?

Yes, IBIS models are available for WT and IT products (JEDEC 153-/169-ball and 100-ball)

What is the e.MMC offering for industrial applications?
Micron is offering an extensive number of solutions for industrial customers, such as five densities and JEDEC-standard BGA 153-/169-ball and custom 100-ball packaging. All of these products will operate in the extended temperature range of -40° to 85°C.
What are the advantages of 100-ball IT e.MMC?

Micron’s 100-ball e.MMC BGA package features a 1.0mm ball pitch for board routing simplification (saving PCB costs) and improved board-level reliability (temp cycling). This solution is particularly attractive to automotive, industrial, and networking market segments. See the following table for additional benefits.

Features of 100-ball e.MMC

Benefits

Large 1.0mm ball pitch

  • Allows for low-cost PCB trace/space designs
  • Simplifies PCB routing
  • Enables a reduction in the number of PCB layers
  • Reduces costs via a lower drill size
  • Lower DAR (drill aspect ratio) for better PCB yields
  • Allows for wider traces for better thermal dissipation

Large 0.45mm nominal ball diameter

  • Provides high PCB board-level reliability
  • Improves surface-mount yields (vs. smaller ball packages)
  • Provides better thermal dissipation

Low ball count (compared to 153-ball e.MMC JEDEC-standard)

  • Allows for easier, low-cost PCB routing
  • Reduces package and PCB costs

100-ball pattern contains 12 mechanical support balls (3 in each corner)

  • Provides excellent PCB board-level reliability
  • Allows for flexible “large package size” variations

Flexible ball-out design

  • Allows for future e.MMC feature upgrades and next-generation technology
How can I migrate from Micron e.MMC 4.4 to 4.41?

Micron has EOL’d its e.MMC 4.4 offering. Refer to your AE for support. A dedicated technical note “TN-FC-08: Migrating from Micron v. 4.4 e.MMC to 4.41 e.MMC” is available for review.

Is it possible to perform a system boot from e.MMC?

Yes, e.MMC provides two boot partitions to provide fast access to boot code for improved system boot time. Booting from boot partitions can provide access to stored data in ~50ms, whereas booting from the user area can take hundreds of milliseconds. However, in order to utilize the boot partitions, the chipset must be able to support booting from the boot partition. Check with your chipset vendor to understand if booting from the e.MMC boot partitions is supported.

Does Micron e.MMC support power-loss protection?

Yes, ESG e.MMC devices support static data protection. Devices are shipped from Micron factories as COMBO with a configuration optimized for best write performance. Customers can reconfigure the devices to protect static (previously written) data if there is power loss during a write operation.

What are the enhanced technology features mentioned in JEDEC specification, and what are the benefits?

A part or all of the MLC user space can be configured as pseudo-SLC. The partition offers better reliability, endurance, and performance compared to MLC NAND.

Can I set up partitions within e.MMC to suit different usage models?

The e.MMC specification allows customers to configure the user data area into a maximum of four separate partitions that can each be configured as MLC (default) or enhanced mode (pSLC). Enhanced mode provides better reliability in exchange for twice the space as MLC.

For more information refer to "TN-FC-40: Embedded e.MMC Configuration"

What is the required software support for e.MMC?

e.MMC drivers are generally available on the market due to the fact that it is an industry-standard product.