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General Product(6)
Does thermal information change for IT parts?
Thermal information includes temperature limits and thermal impedance values. Temperature limits do change for IT parts (TC, TJ, and TA), but thermal impedance values (θJA, θJB, and θJC) do not because thermal impedance depends primarily on the package.
My design was based on a specification stating the JTAG was relative to VDD (1.8V), but now we’ve discovered that JTAG is actually relative to VDDQ (1.5V). It’s a fairly significant board spin to change this; what do I risk by leaving the design as-is? I assume that the specification is still for VDDQ + 0.3V = 1.8V, but with CMOS parts there’s no way I can guarantee that it won’t swing past that on transitions.
Your particular board design should not be a cause of major concern. The pins can handle the VDD voltage regardless of the VDDQ voltage.
Should the ECC memory chip share chip select and CKE signals with the other two main memory chips in our point-to-point application?
The ECC chip(s) should share the same CKE and CS# as the other devices because they are accessed as the same piece of data.
What is a "bank"?
A bank is an array of memory bits. Multiple arrays or banks are contained within a DRAM component. Depending on density, DRAM components may consist of 4 or 8 banks. For example, a bank may consist of 32 million rows, 4 bits across. This would equate to 128 megabits. Four of these banks in a single DRAM component would yield a 512Mb component.
What is the impedance tolerance of the driver in match-impedance mode relative to the expected value base on the perfect reference resistor connected to ZQ pin?
The impedance tolerance of the driver is ±15 percent.
Who do I contact if I have questions about my buymicron.com order?
If you have any questions about your order, contact buymicron.com.
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How do I find my secure site and documents?
Any documents or secure web sites that you have access to are still available on your "My Micron" site.
How do I request a secure document?
Micron offers a number of secure documents. The security status of these documents is denoted by a padlock icon. So, if you navigate to a part that has a secure document, simply click on the document link to begin the process of requesting permission to download that file. Note that if you don’t already have a Micron profile, you will be prompted to create one. From there please follow the account creation and validation steps to gain permission to the document.
Are your NAND parts ONFI-compliant?
All our 50-series NAND devices and beyond are ONFI-compliant.
How will ONFI help speed time-to-market for NAND-based products?
ONFI improves time-to-market in two principal ways: 

1. It simplifies the design of Flash controllers that support a range of components by improving uniformity in the behavior of the interface to the NAND components. 

2. It reduces the design time of Flash components in end-use applications and enables the use of a new generation of NAND components without design or firmware changes.

What is ONFI?
ONFI stands for Open NAND Flash Interface. ONFI is an industry working group that is dedicated to simplifying the integration of NAND Flash memory into consumer electronic products, computing platforms, and various other applications that require solid state mass storage. The ONFI working group defines standardized component-level interface specifications for NAND Flash. ONFI is also defining module connector and module form factor specifications (similar to DRAM DIMMs) for NAND Flash. For more information, visit www.onfi.org.
What types of products will ONFI 2.1 be seen in first?
ONFI improves the embedded integration of Flash components into a range of products, including many that use Flash today, such as mobile phones, PDAs, MP3 players, and notebooks. It’s likely, however, that the benefits of ONFI 2.1 will first be realized in PC platforms. Because of the significantly faster speeds that ONFI 2.1 delivers, SSDs and caching solutions will be able to deliver substantive benefits for PC platform workloads.