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Networking Innovations

Networking Innovations

Next-Generation Bandwidth

The mobility revolution continues to drive the exploding demand for networking bandwidth. We’re addressing this challenge with new memory solutions that deliver equally revolutionary results.

Design Attributes

Compatibility

Our customer and ecosystem partner collaboration improves product reliability and compatibility and optimizes time to market and design costs.

Performance

Performance

Our high performance memory delivers faster data packet processing, buffering, and storage.

Resources

Product Information

Micron’s 8Gb monolithic DDR3 SDRAM is an industry first—enabling more cost-effective scaling of high-density server modules, which lowers total cost of ownership (TCO) for data centers. Our 8Gb monolithic DDR3 SDRAM is ideal for high-end enterprise computing and storage systems, cloud servers, as well as networking applications and client computing systems.

Video
Watch the industry's first interoperability demonstration between Altera Stratix V FPGAs and...
Blog

Our just-announced Altera/HMC reference boards represent an industry first in two ways. Not only are they the industry’s first public demonstration of HMC’s interoperability with FPGAs, but Altera is also the first enabler member of the HMC Consortium to announce product/production support for HMC in their next-generation devices.

Product Information

Knights Landing, Intel’s next-generation Xeon Phi™ CPU architecture, leverages the fundamental DRAM and stacking technologies found in our high-performance, on-package memory, the Hybrid Memory Cube (HMC).

Article

Micron's Hybrid Memory Cube -- a 4 GByte stack of DRAM die on a 160 GByte/second interface now sampling to a few close partners -- almost didn't happen. The first prototype failed to make connections between the DRAM stack and a controller inside the package, forcing an all-hands-on-deck effort to save the project. Two top engineering managers leading the program told some...

Blog

Time-to-market and the ability to “tweak” an existing design to achieve that next level of performance are paramount for system architects, board designers, layout engineers, and others responsible for developing high-performance, cost-sensitive, dependable systems. But if you’re reading this, you understand the frustrations and challenges in trying to meet those goals with...

Programs and Partners

Collaborating with strategic partners is what we do. Our relationships with preferred partners and key enablers are a top priority. Through those relationships, we're building an ecosystem that promotes connections and co development efforts that lead to better solutions for our customers.

Article

We picked ten technologies representative of trends which we expect will redefine our industry in an increasingly interactive world. Admittedly, there are dozens of other examples we could have chosen with equal validity. We welcome your comments on our choices. A few software-related trends were included because they are enabled by electronic technologies. We intentionally...

Products

RLDRAM

RLDRAM Memory

Our reduced-latency DRAM (RLDRAM® memory) is a high-performance, high-density memory solution that offers fast SRAM-like random access and outpaces even leading-edge DDR3 for sustained high bandwidth. RLDRAM uses innovative circuit design to minimize the time between the beginning of an access cycle and the instant that the first data is available. These traits make RLDRAM an ideal choice for 10GbE, 40GbE, and 100GbE packet buffering and inspections, and it’s supported on a wide variety of FPGAs and network processor solutions.

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LRDIMM

Implementing load-reduced DIMMs (LRDIMMs) enables you to add more DIMMs per channel and increase the memory capacity and speed of your systems. Our LRDIMMs use a specially designed buffer to reduce the data load to a single load (up to an 8-rank DIMM), whereas standard RDIMMs present multiple loads for dual-rank and quad-rank versions and limit the amount of data you can load to the data bus.

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Micron HMC

Short-Reach HMC

Our short-reach (SR) Hybrid Memory Cube (HMC) SERDES PHY form factor provides data throughput unlike any other memory device on the market today. It’s designed for systems that use standard FBGA packaging and is an ideal point-to-point memory solution for ASIC, CPU, and ASSP devices.

Our SR HMC is available in a 31mm x 31mm package providing up to 160 GB/s bandwidth.

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DDR3 SDRAM

DDR3 SDRAM

DDR3 is a great solution for compute and embedded systems—from desktop, notebook, server, and networking to industrial, consumer and connected home applications. When you’re ready to design in DDR3, we’ll be here to help. As an industry leader, we are expertly equipped to help you sort through the technical details and recommend the best DDR3 solution for your application.

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DDR4 SDRAM

DDR4 SDRAM

DDR4 is the best mainstream generation of DRAM technology, with new features centered on power savings, performance enhancement, manufacturability, and reliability improvements. These new features improve performance, power, manufacturability, reliability and stacking capabilities for the enterprise, cloud, ultrathin, tablet, automotive and embedded markets. With data rates up to 3200 MT/s, an operating voltage of 1.2v and additional power saving features; DDR4 increases performance up to 50% while delivering total energy savings as high as 25% compared to DDR3.

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VLP RDIMM

Our VLP RDIMMs use up to 67% less board space than standard modules, making your design more compact, slashing thermal power consumption by improving airflow, and delivering the performance you need.

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VLP UDIMM

VLP UDIMM

At the heart of our VLP UDIMMs is the world’s most advanced DRAM technology—designed so that your router, hub, switch, or bridge can be faster, smaller, and much more reliable. In fact, our lower-height, ATCA-compliant VLP UDIMMs are specifically made to be stacked vertically--significantly improving airflow and reducing power consumption. Plus, they are compatible with existing sockets

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GDDR5

GDDR

Micron’s dedicated graphics memories—GDDR5 and GDDR5X—are specifically designed to address the enormous demands of graphics processing by offering high densities and high bandwidth. Their discrete design also simplifies integration, making them a great solution for next-generation, high-performance graphics systems.

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eUSB

Embedded USB

Our embedded universal serial bus (eUSB) devices offer a compelling alternative to other storage solutions. Fast, reliable, and small, our eUSBs excel in harsh environments. Our next-generation eU500 products extend the benefits of current eUSB solutions and deliver enhanced performance and reliability features and pack up to 32GB of USB 3.1-compliant memory storage into their small form factor. These easy-to-implement eUSBs are ideal for boot drives and data logging applications such as networking, embedded computing and server systems.

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RealSSD

SATA SSDs

Our SSDs leverage the SATA 6 Gb/s interface to provide outstanding performance for enterprise blade servers and system storage.

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