Cookie Information

We use cookies to improve the website experience of our users. To learn more about our cookies, visit our Cookies Policy page.

logo-micron

Add Bookmark(s)


To:

Email


Bookmark(s) shared successfully!

Please provide at least one email address.

Technical Notes

TN-10-08: Thermal Implications for LPDDR Die Stacks (pdf)

  • File Type:
  • PDF
  • Updated:
  • 07/26/2010

Description

(TN-10-08)

This technical note presents a case study of a handset simulation in which an LPDRAM is stacked on an application processor (PoP) and the resulting thermal-profile modeling. This note also explains how thermal detection features included in LPDDR and LPDDR2 can be used to monitor the junction temperature of the memory, enabling the application to detect and compensate when the junction temperature exceeds the specified operating temperature.

Login or Sign Up Now for an account to provide feedback on this resource.