MTFDDAK3T8QDE-2AV16AB

Orderable parts

MTFDDAK3T8QDE-2AV16ABYY

Specs

  • Capacity
    3840GB
  • Chipset Validation
    N/A
  • FBGA Code
    N/A
  • Interface
    SATA
  • Op. Temp.
  • Part Status
    Production
  • Product Line
    5210 ION
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • READ
    540 MB/s
  • WRITE
    350 MB/s

Data Sheets

5210 SATA SSD Datasheet

5210 SATA SSD Datasheet
  • File Type: PDF
  • Updated: 2020-08-03

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 11/1/2021

BSMI Taiwan RoHS certificate

Part-specific certification as required by Taiwan's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 11/1/2021

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 11/1/2021

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 11/1/2021

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2021-11-16

TN-FD-23: Calculating Write Amplification Factor

This document describes how to calculate the write amplification factor (WAF) for Micron's M500 family of personal storage SSDs.
  • File Type: PDF
  • Updated: 2014-12-10

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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