MTFDHBE960TDF-1AW1ZAB

Orderable parts

MTFDHBE960TDF-1AW1ZABYY

Specs

  • Capacity
    960GB
  • Chipset Validation
    N/A
  • FBGA Code
    N/A
  • Part Status
    Production
  • Product Line
    7300 PRO
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • READ
    2400 MB/s
  • WRITE
    700 MB/s

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 5/1/2022

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2021-11-16

TN-FD-50: 2100AI/AT SSD Power Supply Electrical Requirements

This technical note summarizes component electrical characteristics and power characteristics for Micron 2100AI/AT PCIe NVMe SSDs.
  • File Type: PDF
  • Updated: 2021-04-23

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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