RC48F4400P0VB0EJ

Orderable parts

RC48F4400P0VB0EJ

Specs

  • Block Config
    Top/Bottom Boot
  • Chipset Validation
    N/A
  • Density
    512Mb
  • FBGA Code
    N/A
  • Op. Temp.
    -40C to +85C
  • Part Family
    P30
  • Part Status
    Obsolete
  • PLP
    No
  • PLP Start Date
    N/A
  • Width
    x16

Data Sheets

P33/P30 256M, 256M/256M Stack Specification Update

Errata
  • File Type: PDF
  • Updated: 5/10/2011

256Mb, 512Mb (256Mb/256Mb) Parallel NOR Flash Embedded Memory (P30-65nm) data sheet

1.7V to 2.0V VCC (core) voltage, 1.7V to 3.6V VCCQ (I/O) voltage
  • File Type: PDF
  • Updated: 9/25/2015

RoHS

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 01/2019

Simulation Models

P30_Verilog, 256+256Mb, 65nm, v1.1

P30_Verilog, 256+256Mb, 65nm, v1.1
  • File Type: ZIP
  • Updated: 5/7/2010

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2/15/2018

Bypass Capacitor Selection for High-Speed Designs

Describes bypass capacitor selection for high-speed designs.
  • File Type: PDF
  • Updated: 3/23/2011

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 10/12/2018

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 8/5/2010
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