RC28F256P30BFE

Orderable parts

RC28F256P30BFE

Specs

  • Block Config
    Bottom Boot
  • Chipset Validation
    N/A
  • Density
    256Mb
  • FBGA Code
    N/A
  • Op. Temp.
    -40C to +85C
  • Part Family
    P30
  • Part Status
    End of Life
  • PLP
    No
  • PLP Start Date
    N/A
  • Width
    x16

Data Sheets

256Mb, 512Mb (256Mb/256Mb) Parallel NOR Flash Embedded Memory (P30-65nm) data sheet

1.7V to 2.0V VCC (core) voltage, 1.7V to 3.6V VCCQ (I/O) voltage
  • File Type: PDF
  • Updated: 2015-09-25T15:13:00.0000000Z

Simulation Models

P30_IBIS, 256Mb, 65nm, EzBGA64, 1.7-3.6V, v1.02

  • File Type: IBS
  • Updated: 2011-02-17T00:00:00.0000000Z

P30_Verilog, 256Mb, 65nm, v1.5

P30_Verilog, 256Mb, 65nm, v1.5
  • File Type: GZ
  • Updated: 2015-08-19T00:00:00.0000000Z

Technical Notes

TN-12-06: Adapting the Linux Kernel for Micron P30, P33, and J3 Flash Memory

This technical note provides a guide for modifying the MTD device-layer software for correct use with Micron P30, P33, and J3 devices. It also describes the modifications required in the Linux environment.
  • File Type: PDF
  • Updated: 2011-10-17T05:00:00.0000000Z

TN-12-05: Password Protecting Flash Memory Blocks

This document describes a method of password protecting blocks using Micron's M29EW device, as an example.
  • File Type: PDF
  • Updated: 2011-03-11T06:00:00.0000000Z

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29T21:36:00.0000000Z

CSN-20: Wafer Packaging and Packaging Materials

Provides complete shipping and recycling information about each of the materials used for shipping Micron's products.
  • File Type: PDF
  • Updated: 2018-09-04T05:00:00.0000000Z
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