M58BW016FB7ZA3F

Orderable parts

M58BW016FB7ZA3F

Specs

  • Block Config
    Bottom Boot
  • Chipset Validation
    N/A
  • Density
    16Mb
  • FBGA Code
    N/A
  • Op. Temp.
    -40C to +125C
  • Part Family
    M58BW
  • Part Status
    Obsolete
  • PLP
    No
  • PLP Start Date
    N/A
  • Width
    x32

Data Sheets

16Mb 3V Parallel NOR Flash: M58BW016DB/T, M58BW016FB/T

16Mb (512Kb x32), 3V, Boot Block, Burst, Parallel NOR Flash Memory
  • File Type: PDF
  • Updated: 2018-06-25T05:00:00.0000000Z

RoHS

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 5/1/2019

Simulation Models

M58BW_IBIS, 16/016, FT/FB_ZA3, 110nm, LBGA80, 2.4/2.7V-3.6V, v1.1

2.4-3.6V for DATA_BUF, R_PAD 2.7-3.6V for AD/EN/L-B/RP/VPEN/WP_PAD
  • File Type: ZIP
  • Updated: 2010-05-07T00:00:00.0000000Z

M58BW_Verilog, 16F, 110nm, v1.2

M58BW16F
  • File Type: ZIP
  • Updated: 2010-05-07T00:00:00.0000000Z

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17T15:39:00.0000000Z

Bypass Capacitor Selection for High-Speed Designs

Describes bypass capacitor selection for high-speed designs.
  • File Type: PDF
  • Updated: 2011-03-23T05:00:00.0000000Z

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29T21:36:00.0000000Z

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05T05:00:00.0000000Z
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