MT35XU512ABA1G12-0AAT

Orderable parts

MT35XU512ABA1G12-0AAT

Specs

  • Chipset Validation
    N/A
  • Density
    512Mb
  • FBGA Code
    RW303
  • Op. Temp.
    -40C to +105C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Type
    Octal I/O
  • Width
    x1/x8

Data Sheets

MT35X Micron Xccela™ Flash Memory, 512Mb, 1.8V, Octal I/O

  • File Type: PDF
  • Updated: 2018-12-21

Brief Datasheet: Xccela™ Flash Memory

This is a public, brief version of the MT35X data sheet. To request access to the full NDA version of the MT35X data sheet, please contact your sales representative.
  • File Type: PDF
  • Updated: 2018-10-02

Addendum: MT35X Automotive NOR Flash Devices

Xccela™ NOR Flash Memory
  • File Type: PDF
  • Updated: 2017-03-05

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 11/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 11/1/2019

Simulation Models

IBIS_MT35XU512ABAxx12-xxTT v2.1.1

x.1= 1, 2. TT= IT, AT, AUT.
  • File Type: ZIP
  • Updated: 2019-03-25

MT35X_1_8V_512Mb_x1_NoCP_Package_VG15.tar

Verilog model_Octal Serial NOR
  • File Type: GZ
  • Updated: 2019-03-25

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17

TN-12-30: NOR Flash Cycling Endurance and Data Retention

This technical note defines the industry standards for this testing, Micron's NOR Flash testing methodology, and the two key metrics used to measure NOR device failure: cycling endurance and data retention.
  • File Type: PDF
  • Updated: 2017-11-15
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Customer Service Notes

CSN-07: RMA Procedures for Packaged Product and Bare Die Devices

Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.
  • File Type: PDF
  • Updated: 2014-01-21

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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