Orderable parts



  • Chipset Validation
  • Density
  • FBGA Code
  • Media
    Tape & Reel
  • Op. Temp.
    -40C to +85C
  • Part Status
  • PLP
  • PLP Start Date
  • Type
    Multi I/O
  • Width

Data Sheets

512Mb, 1.8V, Multiple I/O Serial Flash Memory

512Mb, 1.8V, Multiple I/O Serial Flash Memory
  • File Type: PDF
  • Updated: 3/20/2014


China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 01/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 01/2019

Simulation Models

IBIS_N25Q512Ax1GSF4 v1.0

x.1= configuration.
  • File Type: ZIP
  • Updated: 12/18/2017

Technical Notes

TN-25-01: Migrating from Micron's N25Q to Micron's MT25Q

This technical note describes the process for converting a system design from the Micron N25Q Flash memory device to the Micron MT25Q Flash memory device. PCN's 32162, 32163
  • File Type: PDF
  • Updated: 11/10/2017

TN-25-33: Migrating from Micron's N25Q 8–64Mb to Micron's MT25Q 128Mb

Migrating from Micron N25Q 8/16/32/64Mb to Micron MT25Q 128Mb
  • File Type: PDF
  • Updated: 4/12/2017

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 10/12/2018

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 8/5/2010