MT25QU512ABB8ESF-0AAT

Orderable parts

MT25QU512ABB8ESF-0AAT

Specs

  • Chipset Validation
    N/A
  • Density
    512Mb
  • FBGA Code
    RW241
  • Media
  • Op. Temp.
    -40C to +105C
  • Part Status
    Production
  • PLP
    No
  • PLP Start Date
    N/A
  • Type
    Multi I/O
  • Width
    x1/x2/x4

Data Sheets

Error Correction Code in Automotive NOR Flash Devices

This addendum describes the error correction code (ECC) implemented in the MT25Q and MT25T single-level cell automotive 128Mb, 256Mb, 512Mb, and 1Gb NOR Flash devices.
  • File Type: PDF
  • Updated: 3/24/2015

Automotive features for MT25QLxxxABAxExx-0AAT

Addendum for MT25QL Automotive features
  • File Type: PDF
  • Updated: 3/10/2016

MT25Q, 512Mb, 1.8V Multiple I/O Serial Flash Memory Data Sheet

MT25Q is a high-performance multiple input/output, 512Mb, 1.8V, SPI Flash memory device; MT25QU512ABB
  • File Type: PDF
  • Updated: 1/8/2018

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 01/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 01/2019

Simulation Models

MT25Q_512Gb_1.8V_64KB_MicronXIP_Reset_RevB_Standard_VG1.2.tar

Verilog model, Standard model, MT25QU512ABB8Epp-0
  • File Type: GZ
  • Updated: 7/1/2015

IBIS_MT25QU512ABBxxPP-xxTT v2.6.2

PP= 12, SF, W9, 56. TT= IT, AT, AUT.
  • File Type: ZIP
  • Updated: 9/25/2017

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2/15/2018

TN-12-30: NOR Flash Cycling Endurance and Data Retention

This technical note defines the industry standards for this testing, Micron's NOR Flash testing methodology, and the two key metrics used to measure NOR device failure: cycling endurance and data retention.
  • File Type: PDF
  • Updated: 11/15/2017

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 10/12/2018

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 8/5/2010
+