MT25QU512ABA8E12-1SIT

Orderable parts

MT25QU512ABA8E12-1SIT

Specs

  • Chipset Validation
    N/A
  • Density
    512Mb
  • FBGA Code
    RW147
  • Media
  • Op. Temp.
    -40C to +85C
  • Part Status
    Obsolete
  • PLP
    No
  • PLP Start Date
    N/A
  • Type
    Multi I/O
  • Width
    x1/x2/x4

Data Sheets

MT25Q Security Addendum

The additional protection features available on the secure MT25Q device include a lock status register bit, top/bottom block address protection lock, volatile configuration lock register at power up, protection management register lock, and a nonvolatile configuration lock register.
  • File Type: PDF
  • Updated: 8/10/2017

MT25Q 512Mb, 1.8v, Multiple I/O Serial Flash Memory

The MT25Q is a high-performance multiple input/output, 512Mb, 1.8V, 45nm SPI Flash memory device; MT25QU512ABA
  • File Type: PDF
  • Updated: 8/6/2014

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 02/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 02/2019

Simulation Models

IBIS_MT25QU512ABAxxPP-xxTT v2.1

PP= 12, SF. TT= IT, AT
  • File Type: ZIP
  • Updated: 5/28/2015

Technical Notes

TN-25-38: Power Supply Considerations for NOR Flash Devices

This technical note provides direction on how to properly apply and remove the power supply to a NOR Flash device from the MT25Q, MT25T, and MT35X families.
  • File Type: PDF
  • Updated: 12/14/2017

TN-25-04: Migrating from Macronix MX66L51235F to Micron's MT25Q 512Mb Flash Device

This technical note compares the features of the Micron MT25Q (512Mb) Flash memory device with the Macronix MX66L51235F Flash memory device.
  • File Type: PDF
  • Updated: 12/7/2018

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 10/12/2018

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 8/5/2010
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