MT25QU256ABA8E12-0AAT

Orderable parts

MT25QU256ABA8E12-0AAT

Specs

  • Chipset Validation
    N/A
  • Density
    256Mb
  • FBGA Code
    RW230
  • Media
  • Op. Temp.
    -40C to +105C
  • Part Status
    Contact Factory
  • PLP
    No
  • PLP Start Date
    N/A
  • Type
    Standard
  • Width
    x1/x2/x4

Data Sheets

MT25Q 256Mb, 1.8V, Multiple I/O Serial Flash Memory

MT25QU256ABA
  • File Type: PDF
  • Updated: 2019-03-08

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 8/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 8/1/2019

Simulation Models

IBIS_MT25QU256ABAxxPP-xxTT v2.6.2

PP= 12, 14, SF, W7, W9, 55. TT= IT, AT, AUT.
  • File Type: ZIP
  • Updated: 2018-06-01

MT25Q_256Mb_1.8V_64KB_MicronXIP_Reset_VG17.tar

Verilog model, MT25QU256ABA8E0, 166MHz
  • File Type: GZ
  • Updated: 2019-03-25

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17

TN-12-30: NOR Flash Cycling Endurance and Data Retention

This technical note defines the industry standards for this testing, Micron's NOR Flash testing methodology, and the two key metrics used to measure NOR device failure: cycling endurance and data retention.
  • File Type: PDF
  • Updated: 2017-11-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-18: Bare Die SiPs and MCMs

Describes design considerations for bare die SiPs and MCMs.
  • File Type: PDF
  • Updated: 2009-04-06
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