MT25QL256ABA8E14-1SIT

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Orderable parts

MT25QL256ABA8E14-1SIT

Specs

  • Chipset Validation
    N/A
  • Density
    256Mb
  • FBGA Code
    RW165
  • Media
  • Op. Temp.
    -40C to +85C
  • Part Status
    Contact Factory
  • PLP
    No
  • PLP Start Date
    N/A
  • Type
    Multi I/O Secure
  • Width
    x1/x2/x4

Data Sheets

MT25Q Security Addendum

The additional protection features available on the secure MT25Q device include a lock status register bit, top/bottom block address protection lock, volatile configuration lock register at power up, protection management register lock, and a nonvolatile configuration lock register.
  • File Type: PDF
  • Updated: 8/10/2017
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MT25Q 256Mb, 3V, Multiple I/O Serial Flash Memory

MT25QL256ABA
  • File Type: PDF
  • Updated: 7/22/2018
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RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 02/2019
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RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 02/2019
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Simulation Models

MT25Q_256Mb_3V_64KB_MicronXIP_Reset_Secure_VG13.tar

Verilog model, MT25QL256ABA8E1
  • File Type: GZ
  • Updated: 10/23/2015
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IBIS_MT25QL256ABAxxPP-xxTT v2.6.1

PP= 12, 14, SF, W9, W7. TT= IT, AT, AUT.
  • File Type: ZIP
  • Updated: 9/27/2017
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Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2/15/2018
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TN-12-30: NOR Flash Cycling Endurance and Data Retention

This technical note defines the industry standards for this testing, Micron's NOR Flash testing methodology, and the two key metrics used to measure NOR device failure: cycling endurance and data retention.
  • File Type: PDF
  • Updated: 11/15/2017
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Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 10/12/2018
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ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 8/5/2010
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