MT25QL128ABA8E14-1SIT

Orderable parts

MT25QL128ABA8E14-1SIT

Specs

  • Chipset Validation
    N/A
  • Density
    128Mb
  • FBGA Code
    RW211
  • Media
  • Op. Temp.
    -40C to +85C
  • Part Status
    End of Life
  • PLP
    No
  • PLP Start Date
    N/A
  • Type
    Multi I/O Secure
  • Width
    x1/x2/x4

Data Sheets

MT25Q Security Addendum

The additional protection features available on the secure MT25Q device include a lock status register bit, top/bottom block address protection lock, volatile configuration lock register at power up, protection management register lock, and a nonvolatile configuration lock register.
  • File Type: PDF
  • Updated: 8/10/2017

MT25Q 128Mb, 3V, Multiple I/O Serial Flash Memory MT25QL128ABA

MT25QL128ABA is a high-performance multiple input/output, 128Mb, 3V, SPI Flash memory device.
  • File Type: PDF
  • Updated: 5/8/2018

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 02/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 02/2019

Simulation Models

IBIS_MT25QL128ABAxxPP-xxTT v2.7

PP= 12, 14, SE, SF, W7, W9. TT= IT, AT.
  • File Type: ZIP
  • Updated: 6/13/2017

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2/15/2018

TN-12-30: NOR Flash Cycling Endurance and Data Retention

This technical note defines the industry standards for this testing, Micron's NOR Flash testing methodology, and the two key metrics used to measure NOR device failure: cycling endurance and data retention.
  • File Type: PDF
  • Updated: 11/15/2017

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 10/12/2018

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 8/5/2010
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