MT25QL01GBBA8E12-1SIT

Orderable parts

MT25QL01GBBA8E12-1SIT

Specs

  • Chipset Validation
    N/A
  • Density
    1Gb
  • FBGA Code
    RW156
  • Media
  • Op. Temp.
    -40C to +85C
  • Part Status
    Obsolete
  • PLP
    No
  • PLP Start Date
    N/A
  • Type
    Multi I/O
  • Width
    x1/x2/x4

Data Sheets

DSV - MT25Q 1Gb, 3V, Multiple I/O Serial Flash Memory

Data Sheet Variance on Icc specifications.
  • File Type: PDF
  • Updated: 6/9/2014

MT25Q 1Gb, 3V, Multiple I/O Serial Flash Memory

The MT25Q is a high-performance multiple input/output, 1Gb, 3V, SPI Flash memory device; MT25QL01GBBA
  • File Type: PDF
  • Updated: 7/25/2014

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 02/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 02/2019

Simulation Models

MT25Q_1Gb_3V_64KB_MicronXIP_Reset_SecuredOTP_VG14_tar

Verilog model: Micron XIP, Reset, Secured OTP, MT25QL01GBBA8E_1
  • File Type: GZ
  • Updated: 6/9/2015

IBIS_MT25QL01GBBAxx12-xxTT v2.2

TT= IT, AT.
  • File Type: ZIP
  • Updated: 6/9/2015

IBIS_MT25QL01GBBBxxPP-xxTT v2.2

PP= 12, SF, W9. TT= IT, AT, AUT.
  • File Type: ZIP
  • Updated: 9/25/2017

Technical Notes

TN-25-05: N25Q and MT25Q Serial Flash Stacked Devices

This technical note describes the features of stacked devices for N25Q and MT25Q. These devices are memory with two or more dies in the same package.
  • File Type: PDF
  • Updated: 5/8/2017

TN-25-07: Tuning Data Pattern for MT25Q and MT25T Devices

This technical note describes the Tuning Data Pattern (TDP). TDP provides applications with a set of data patterns which can be used to adjust the data latching point at the host end when the clock frequency is set higher than 133 MHz in STR mode and higher than 66 MHz in double transfer rate (DTR) mode.
  • File Type: PDF
  • Updated: 4/23/2015

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 10/12/2018

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 8/5/2010
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