N25Q512A83G1241F

Orderable parts

N25Q512A83G1241F

Specs

  • Chipset Validation
    N/A
  • Density
    512Mb
  • FBGA Code
    N/A
  • Media
    Tape & Reel
  • Op. Temp.
    -40C to +85C
  • Part Status
    Obsolete
  • PLP
    No
  • PLP Start Date
    N/A
  • Type
    Multi I/O
  • Width
    x1/x2/x4

Data Sheets

512Mb, 3V, Multiple I/O Serial Flash Memory

N25Q is a high-performance multiple input/output, 512Mb, 3V, serial Flash memory device.
  • File Type: PDF
  • Updated: 2018-06-13T05:00:00.0000000Z

N25Q 512Mb 3v, Multiple I/O Serial Flash Memory with Security

N25Q 512Mb 3v, Multiple I/O Serial Flash Memory with Security
  • File Type: PDF
  • Updated: 2014-02-20T17:15:00.0000000Z

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 5/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 5/1/2019

Simulation Models

IBIS_N25Q512Ax3G124 v1.4

x.1= configuration.
  • File Type: ZIP
  • Updated: 2017-12-18T06:00:00.0000000Z

Verilog model, N25Q, 512A13E, 3.0V, v1.3

512Mb 3.0V Micron XIP Hold pin
  • File Type: GZ
  • Updated: 2014-07-08T00:00:00.0000000Z

Technical Notes

TN-25-01: Migrating from Micron's N25Q to Micron's MT25Q

This technical note describes the process for converting a system design from the Micron N25Q Flash memory device to the Micron MT25Q Flash memory device. PCN's 32162, 32163
  • File Type: PDF
  • Updated: 2017-11-10T06:00:00.0000000Z

TN-25-05: N25Q and MT25Q Serial Flash Stacked Devices

This technical note describes the features of stacked devices for N25Q and MT25Q. These devices are memory with two or more dies in the same package.
  • File Type: PDF
  • Updated: 2017-05-08T05:00:00.0000000Z

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29T21:36:00.0000000Z

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05T05:00:00.0000000Z
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