M25P32-VMF6PBA

Orderable parts

M25P32-VMF6PBA

Specs

  • Chipset Validation
    N/A
  • Density
    32Mb
  • FBGA Code
    N/A
  • Media
    Tube
  • Op. Temp.
    -40C to +85C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Type
    Data Storage
  • Width
    x1

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-12-25: Land Pad Design for NOR Flash Memories

High-level information on Micron's NOR Flash memory packages and their suggested PCB land patterns.
  • File Type: PDF
  • Updated: 2013-10-25
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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