RC48F4400P0TB0EJ

Orderable parts

RC48F4400P0TB0EJ

Specs

  • Block Config
    Top/Bottom Boot
  • Chipset Validation
    N/A
  • Density
    512Mb
  • FBGA Code
    N/A
  • Op. Temp.
    -40C to +85C
  • Part Family
    P33
  • Part Status
    Obsolete
  • PLP
    No
  • PLP Start Date
    N/A
  • Width
    x16

Data Sheets

P33/P30 256M, 256M/256M Stack Specification Update

Errata
  • File Type: PDF
  • Updated: 5/10/2011

256Mb, 512Mb (256Mb/256Mb) Parallel NOR Flash Embedded Memory (P33-65nm) data sheet

2.3V to 3.6V VCC (core) voltage, 2.3V to 3.6V VCCQ (I/O) voltage
  • File Type: PDF
  • Updated: 2/9/2018

RoHS

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 02/2019

Simulation Models

P33_Verilog, 256+256Mb, 65nm, v1.1

P33_Verilog, 256+256Mb, 65nm, v1.1
  • File Type: ZIP
  • Updated: 5/7/2010

P33_IBIS, 256+256Mb, 65nm, EzBGA64, 2.3-3.6V, v1.1

  • File Type: IBS
  • Updated: 4/4/2014

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2/15/2018

TN-00-20: Understanding Signal Integrity

Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life
  • File Type: PDF
  • Updated: 12/15/2009

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 10/12/2018

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 8/5/2010
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