PF48F3000P0ZTQEA

Orderable parts

PF48F3000P0ZTQEA

Specs

  • Block Config
    Top Boot
  • Chipset Validation
    N/A
  • Density
    128Mb
  • FBGA Code
    N/A
  • Op. Temp.
    -40C to +85C
  • Part Family
    P30
  • Part Status
    End of Life
  • PLP
    No
  • PLP Start Date
    N/A
  • Width
    x16

Data Sheets

64Mb, 128Mb Parallel NOR Flash: P30

64Mb, 128Mb, 65nm, Single Bit Per Cell, Parallel NOR Flash
  • File Type: PDF
  • Updated: 2/15/2011

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 02/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 02/2019

Simulation Models

P30_Verilog, 128Mb, 65nm, v1.0

Verilog model updated
  • File Type: GZ
  • Updated: 3/9/2015

P30_IBIS, 128Mb, 65nm, QUAD88, 1.65-2.0V, v1.02

  • File Type: IBS
  • Updated: 5/7/2010

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2/15/2018

TN-00-20: Understanding Signal Integrity

Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life
  • File Type: PDF
  • Updated: 12/15/2009

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 10/12/2018

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 8/5/2010
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