PC28F256P30BFF

Orderable parts

PC28F256P30BFF

Specs

  • Block Config
    Bottom Boot
  • Chipset Validation
    N/A
  • Density
    256Mb
  • FBGA Code
    N/A
  • Op. Temp.
    -40C to +85C
  • Part Family
    P30
  • Part Status
    End of Life
  • PLP
    No
  • PLP Start Date
    N/A
  • Width
    x16

Data Sheets

256Mb, 512Mb (256Mb/256Mb) Parallel NOR Flash Embedded Memory (P30-65nm) data sheet

1.7V to 2.0V VCC (core) voltage, 1.7V to 3.6V VCCQ (I/O) voltage
  • File Type: PDF
  • Updated: 9/25/2015

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 02/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 02/2019

Simulation Models

P30_Verilog, 256Mb, 65nm, v1.5

P30_Verilog, 256Mb, 65nm, v1.5
  • File Type: GZ
  • Updated: 8/19/2015

IBIS Model Ezbga P30 256Mb 1.8V nominal voltalge custom 65nm

min 1.7v nominal 1.8v max 2.0v
  • File Type: IBS
  • Updated: 8/19/2013

P30_IBIS, 256Mb, 65nm, EzBGA64, 1.7-3.6V, v1.02

  • File Type: IBS
  • Updated: 2/17/2011

Technical Notes

TN-12-06: Adapting the Linux Kernel for Micron P30, P33, and J3 Flash Memory

This technical note provides a guide for modifying the MTD device-layer software for correct use with Micron P30, P33, and J3 devices. It also describes the modifications required in the Linux environment.
  • File Type: PDF
  • Updated: 10/17/2011

TN-12-05: Password Protecting Flash Memory Blocks

This document describes a method of password protecting blocks using Micron's M29EW device, as an example.
  • File Type: PDF
  • Updated: 3/11/2011

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 10/12/2018

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 8/5/2010
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