PC28F00AM29EWLA

Orderable parts

PC28F00AM29EWLA

Specs

  • Chipset Validation
    N/A
  • Density
    1Gb
  • FBGA Code
    N/A
  • Op. Temp.
    -40C to +85C
  • Part Family
    M29EW
  • Part Status
    End of Life
  • PLP
    No
  • PLP Start Date
    N/A
  • Width
    x8/x16

Data Sheets

AN 308031: M29EW Secure Datasheet Addendum

M29EW Secure Datasheet Addendum
  • File Type: PDF
  • Updated: 9/14/2011

M29EW 256Mb, 512Mb, 1Gb, 2Gb, 3V Parallel NOR Flash: M29EW

(x8/x16), 3V, Uniform Block, Parallel NOR Flash
  • File Type: PDF
  • Updated: 11/29/2016

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 12/2018

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 12/2018

SIM Models

M29EW_Verilog, 1Gb, 65nm, v1.3

M29EW_Verilog, 1Gb, 65nm, v1.3
  • File Type: GZ
  • Updated: 10/1/2014

M29EW_IBIS, 1Gb, 65nm, FBGA64, 2.7-3.6V, v1.02

  • File Type: IBS
  • Updated: 2/18/2011

M29EW_IBIS, 1Gb, 65nm, FBGA64, 2.97-3.63V, v1.02

  • File Type: IBS
  • Updated: 2/18/2011

Technical Notes

TN-13-12: Software Driver for M29EW NOR Flash Memory

This technical note describes the C library source code for the Micron M29EW parallel NOR Flash memory device using the Flash device driver software interface V3. Download the low-level driver described in this document here.
  • File Type: PDF
  • Updated: 4/26/2015

TN-13-37: Migrating from Micron M29EW Devices to MT28EW NOR Flash Devices

This technical note describes the process for converting a system design from the Micron M29EW devices to MT28EW single-level cell NOR Flash devices, including 128Mb, 256Mb, 512Mb, and 1Gb densities. PCN's 32162, 32163
  • File Type: PDF
  • Updated: 9/10/2014

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 10/12/2018

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 8/5/2010
+