MT28FW01GABA1HJS-0AAT

Orderable parts

MT28FW01GABA1HJS-0AAT

Specs

  • Block Config
    High Lock
  • Chipset Validation
    N/A
  • Density
    1Gb
  • FBGA Code
    N/A
  • Op. Temp.
    -40C to +105C
  • Part Family
    FW-Series
  • Part Status
    Contact Factory
  • PLP
    No
  • PLP Start Date
    N/A
  • Width
    x16

Data Sheets

1Gb, x16, 3V, MT28FW Automotive Parallel NOR Data Sheet

Parallel NOR Flash Automotive Memory
  • File Type: PDF
  • Updated: 2018-05-10T05:00:00.0000000Z

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 5/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 5/1/2019

Simulation Models

IBIS_MT28FW01GABA1xPP-xxTT v2.2

I/O ranges supported= 1.65–1.95V, 2.7–3.6V. PP (packages)= JS, PC.
  • File Type: ZIP
  • Updated: 2016-11-11T06:00:00.0000000Z

VLOG_MT28FW_Automotive_1Gbit_High lock

Verilog: MT28FW01GABA1Hpp-0xtt
  • File Type: GZ
  • Updated: 2015-01-09T00:00:00.0000000Z

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17T15:39:00.0000000Z

TN-13-41: Migrating from S29GL-S Devices to MT28FW NOR Flash Devices

This technical note describes the process for converting a system design for the Spansion S29GL-S device to a system design for the Micron MT28FW single-level cell NOR Flash device, including 512Mb and 1Gb densities.
  • File Type: PDF
  • Updated: 2014-12-11T06:00:00.0000000Z

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29T21:36:00.0000000Z

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05T05:00:00.0000000Z
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