M58BW32FB4ZA3T

Orderable parts

M58BW32FB4ZA3T

Specs

  • Block Config
    Bottom Boot
  • Chipset Validation
    N/A
  • Density
    32Mb
  • FBGA Code
    N/A
  • Op. Temp.
    -40C to +125C
  • Part Family
    M58BW
  • Part Status
    End of Life
  • PLP
    No
  • PLP Start Date
    N/A
  • Width
    x32

Data Sheets

16Mb, 32Mb 3.3V Parallel NOR Flash: M58BW16F, M58BW32F

16Mb, 32Mb, x32, 3.3V, Boot Block, Burst, Parallel NOR Flash Memory
  • File Type: PDF
  • Updated: 6/25/2018

RoHS

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 02/2019

Simulation Models

M58BW_Verilog, 32F, 110nm, v1.2

M58BW32F, 32Mb
  • File Type: ZIP
  • Updated: 5/7/2010

m58bw32f_lbga80.ibs - IBIS Model, M58BW32F, 32Mb, T=125C, LBGA 80-ball

  • File Type: IBS
  • Updated: 4/4/2013

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2/15/2018

TN-00-20: Understanding Signal Integrity

Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life
  • File Type: PDF
  • Updated: 12/15/2009

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 10/12/2018

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 8/5/2010
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