M29W800FB70ZA3SF

Orderable parts

M29W800FB70ZA3SF

Specs

  • Block Config
    Bottom Boot
  • Chipset Validation
    N/A
  • Density
    8Mb
  • FBGA Code
    N/A
  • Op. Temp.
    -40C to +125C
  • Part Family
    M29W
  • Part Status
    Obsolete
  • PLP
    No
  • PLP Start Date
    N/A
  • Width
    x8/x16

Data Sheets

4Mb, 8Mb 3V Parallel NOR Flash: M29W400FB/FT, M29W800FB/FT

4Mb (512Kb x8 or 256Kb x16); 8Mb (1Mb x8 or 512Kb x16), Boot Block, Parallel NOR Flash Memory
  • File Type: PDF
  • Updated: 2018-05-30T05:00:00.0000000Z

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 5/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 5/1/2019

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17T15:39:00.0000000Z

TN-13-07: Patching the Linux Kernel and U-Boot for Micron M29 Flash Memory

This technical note provides a guide for modifying the memory technology device (MTD) layer software for the purpose of correctly using Micron M29 family Flash memory devices in a Linux environment. This document also describes the modifications required to make a Linux environment work with M29 Flash memory devices.
  • File Type: PDF
  • Updated: 2011-04-05T05:00:00.0000000Z

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29T21:36:00.0000000Z

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05T05:00:00.0000000Z
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