Orderable parts



  • Block Config
    Low Lock
  • Chipset Validation
  • Density
  • FBGA Code
  • Op. Temp.
    -40C to +85C
  • Part Family
  • Part Status
    End of Life
  • PLP
  • PLP Start Date
  • Width

Data Sheets

64Mb 3V Parallel NOR Flash: M29W640GB/GH/GL/GT

64Mb (8Mb x8 or 4Mb x16), Uniform Block or Boot Block, Parallel NOR Flash Memory
  • File Type: PDF
  • Updated: 2018-02-09T06:00:00.0000000Z


China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 4/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 4/1/2019

Simulation Models

M29W_VHDL, 640GH/GL, 110nm, v1.0

  • File Type: ZIP
  • Updated: 2010-05-07T05:00:00.0000000Z

M29W_IBIS, 640GH/GL_NB6, 110nm (T9HX), TSOP56, 2.7-3.6V, v1.0

  • File Type: ZIP
  • Updated: 2010-05-07T00:00:00.0000000Z

Technical Notes

AN 309009: Migrating to Numonyx M29EW-S Devices from Spansion S29GLP/N-S Devices.

Application Note 309009
  • File Type: PDF
  • Updated: 2010-11-09T00:00:00.0000000Z

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2018-02-15T06:00:00.0000000Z

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2018-10-12T05:00:00.0000000Z

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05T05:00:00.0000000Z