M29W400DB55N6E

Orderable parts

M29W400DB55N6E

Specs

  • Chipset Validation
    N/A
  • Density
    4Mb
  • FBGA Code
    N/A
  • Op. Temp.
    -40C to +85C
  • Part Family
    M29W
  • Part Status
    End of Life
  • PLP
    No
  • PLP Start Date
    N/A
  • Width
    x8/x16

Data Sheets

4Mb 3V Parallel NOR Flash: M29W400DB/DT

4Mb (512Kb x8 or 256Kb x16), 3V, Boot Block, Parallel NOR Flash Memory
  • File Type: PDF
  • Updated: 1/30/2018

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 12/2018

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 12/2018

SIM Models

M29W_VHDL, 400D, v1.0

  • File Type: ZIP
  • Updated: 5/7/2010

M29W400D_I3.zip - IBIS Model, M29W400D, 4Mb, T=85C, TFBGA48(ZE) 6x8mm

  • File Type: ZIP
  • Updated: 4/4/2013

M29W_IBIS, 400DT/DB_N6, 110nm (T9HX), TSOP48, 2.7-3.6V, v1.1

  • File Type: IBS
  • Updated: 7/15/2011

Technical Notes

AN 309005: Migrating to Numonyx M29W400D Devices from Spansion S29AL004D Devices.

Application Note 309005
  • File Type: PDF
  • Updated: 11/9/2010

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2/15/2018

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 10/12/2018

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 8/5/2010
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