M29W320DT70ZE6E

Orderable parts

M29W320DT70ZE6E

Specs

  • Block Config
    Top Boot
  • Chipset Validation
    N/A
  • Density
    32Mb
  • FBGA Code
    N/A
  • Op. Temp.
    -40C to +85C
  • Part Family
    M29W
  • Part Status
    Obsolete
  • PLP
    No
  • PLP Start Date
    N/A
  • Width
    x8/x16

Data Sheets

M29W320DB/DT: 32Mb, 3V Parallel NOR Flash

Rev. 13
  • File Type: PDF
  • Updated: 1/29/2018

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 02/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 02/2019

Simulation Models

M29W_VHDL, 320D, v1.0

M29W320D
  • File Type: ZIP
  • Updated: 5/7/2010

M29W_Verilog, 320D, v1.1

M29W320D
  • File Type: ZIP
  • Updated: 5/7/2010

M29W_IBIS, 320DT/DB_ZE6, 110nm (T9HX), TFBGA48, 2.7-3.6V, v1.0

  • File Type: ZIP
  • Updated: 5/7/2010

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2/15/2018

TN-00-20: Understanding Signal Integrity

Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life
  • File Type: PDF
  • Updated: 12/15/2009

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 10/12/2018

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 8/5/2010
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