Orderable parts



  • Block Config
    Low Lock
  • Chipset Validation
  • Density
  • FBGA Code
  • Op. Temp.
    -40C to +85C
  • Part Family
  • Part Status
  • PLP
  • PLP Start Date
  • Width

Data Sheets

ERRATA - 256Mb 3V Parallel NOR Flash: M29W256GH/GL

Errata for EDP after erase on M29W256G date codes 1506 and 1512-1552
  • File Type: PDF
  • Updated: 1/15/2016

256Mb 3V Parallel NOR Flash: M29W256GH/GL

256Mb (32Mb x8 or 16Mb x16), 3V, Page, Uniform Block, Parallel NOR Flash Memory
  • File Type: PDF
  • Updated: 2/9/2018


China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 02/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 02/2019

Simulation Models

M29W_Verilog, 256G, 65nm, vg12

M29W256G 256Mb
  • File Type: GZ
  • Updated: 4/17/2012

M29W256G/M29W256GS IBIS model, 65nm, 1.65-3.6V(80ns)/2.7-3.6V(70ns), v1.2

  • File Type: ZIP
  • Updated: 2/20/2014

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2/15/2018

TN-00-20: Understanding Signal Integrity

Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life
  • File Type: PDF
  • Updated: 12/15/2009

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 10/12/2018

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 8/5/2010