M29W064FB6AZA6E

Orderable parts

M29W064FB6AZA6E

Specs

  • Block Config
    Bottom Boot
  • Chipset Validation
    N/A
  • Density
    64Mb
  • FBGA Code
    N/A
  • Op. Temp.
    -40C to +85C
  • Part Family
    M29W
  • Part Status
    Obsolete
  • PLP
    No
  • PLP Start Date
    N/A
  • Width
    x8/x16

Data Sheets

64Mb 3V Parallel NOR Flash: M29W064FB, M29W064FT

64Mb (8Mb x8 or 4Mb x16), 3V, Page, Boot Block, Parallel NOR Flash Memory
  • File Type: PDF
  • Updated: 2018-06-05T05:00:00.0000000Z

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 5/1/2019

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 5/1/2019

Simulation Models

M29W_IBIS, 640FT/FB_ZA6, 110nm (T9HX), TFBGA48, 2.7-3.6V, v1.0

  • File Type: ZIP
  • Updated: 2010-05-07T00:00:00.0000000Z

M29W_VHDL, 640F, 110nm, v1.0

M29W640F, 64Mb
  • File Type: ZIP
  • Updated: 2013-04-04T09:37:00.0000000Z

Technical Notes

TN-00-08: Thermal Applications

Describes some considerations in thermal applications for Micron memory devices
  • File Type: PDF
  • Updated: 2019-04-17T15:39:00.0000000Z

Bypass Capacitor Selection for High-Speed Designs

Describes bypass capacitor selection for high-speed designs.
  • File Type: PDF
  • Updated: 2011-03-23T05:00:00.0000000Z

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2019-04-29T21:36:00.0000000Z

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05T05:00:00.0000000Z
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