M29F800FT55N3F2

Orderable parts

M29F800FT55N3F2

Specs

  • Chipset Validation
    N/A
  • Density
    8Mb
  • FBGA Code
    N/A
  • Op. Temp.
    -40C to +125C
  • Part Family
    M29F
  • Part Status
    Obsolete
  • PLP
    No
  • PLP Start Date
    N/A
  • Width
    x8/x16

Data Sheets

5V Parallel NOR Flash: M29F 200/400/800/160FT, 200/400/800/160FB

Top/Bottom Boot Block, 5V, Parallel NOR Flash Memory
  • File Type: PDF
  • Updated: 6/5/2018

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 12/2018

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 12/2018

Technical Notes

TN-13-22: Migrating to Micron M29FxxxF Devices from Spansion Am29F Flash Devices.

Explains how to convert a system design.
  • File Type: PDF
  • Updated: 8/6/2015

TN-13-13: Software Device Drivers for Micron M29Fxx NOR Flash Memory

This technical note provides C library source code for the M29Fxx Flash memory using the Flash software device driver interface. Download the low-level driver described in this document here.
  • File Type: PDF
  • Updated: 11/10/2010

Customer Service Notes

Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 10/12/2018

ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 8/5/2010
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